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Poly(amic acid) composition, polyimide composition and polyimide molded body

A technology of polyamic acid and composition, applied in the field of polymer compounds and polyimide moldings, can solve the problems of reduced mechanical strength and durability, and achieve the effect of excellent transparency

Inactive Publication Date: 2021-11-09
OSAKA SODA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although polyimides containing repeating units derived from these monomers have improved transparency, mechanical strength and durability may be greatly reduced

Method used

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  • Poly(amic acid) composition, polyimide composition and polyimide molded body
  • Poly(amic acid) composition, polyimide composition and polyimide molded body
  • Poly(amic acid) composition, polyimide composition and polyimide molded body

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0056]

[0057] [polyamic acid]

[0058] The polyamic acid composition of the first embodiment of the present invention contains polyamic acid and a solvent. The polyamic acid composition (hereinafter, sometimes referred to as "polyamic acid composition (A)") consists of a repeating unit (hereinafter, sometimes referred to as "repeating unit (A)") represented by the following general formula (A) The polyamic acid (hereinafter, sometimes described as "polyamic acid (A)") is dissolved or dispersed in a solvent.

[0059] [chemical formula 3]

[0060]

[0061] In general formula (A):

[0062] R A and R B each independently is a hydrogen atom or a methyl group;

[0063] R C is a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, or an alkenyl group with 2 to 10 carbon atoms;

[0064] B A is a divalent organic group;

[0065] B 3 and B 4 each independently -C(=O)- or -CH 2 -;

[0066] G 1 and G 2 Each independently contains at least one ring selected from t...

no. 2 approach

[0269]

[0270] The polyimide composition of 2nd Embodiment of this invention contains polyimide and a solvent. The polyimide composition consists of a polyimide (hereinafter, sometimes referred to as "polyimide") comprising a repeating unit represented by the following general formula (B) (hereinafter, sometimes referred to as "repeating unit (B)"). (B)") is formed by dissolving or dispersing in a solvent.

[0271] [chemical formula 21]

[0272]

[0273] In general formula (B),

[0274] R D and R E each independently is a hydrogen atom or a methyl group;

[0275] R F is a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, or an alkenyl group with 2 to 10 carbon atoms;

[0276] B D is a divalent organic group;

[0277] B 5 and B 6 each independently -C(=O)- or -CH 2 -;

[0278] G 3 and G 4 Each independently contains at least one ring selected from the group consisting of aliphatic rings and aromatic rings, or each independently linear alkanetriyl with...

no. 3 approach

[0351]

[0352] The polyimide molded article of the third embodiment of the present invention is formed by molding the polyamic acid composition of the first embodiment or the polyimide composition of the second embodiment. That is, the polyimide molded article of 3rd Embodiment contains polyimide (B) (for example, polyimide (V)-(VIII)).

[0353] This polyimide molded article is suitable for the following applications, for example, liquid crystal alignment film, passivation film, wire covering material, adhesive film, flexible electronic substrate film, copper clad laminate film, laminate film, electrical insulation film , Porous membranes for fuel cells, separation membranes, heat-resistant coatings, IC packages, resist films, planarization films, lenses such as microlens array films, optical fiber coating films, display substrates, optical waveguides, optical Filters, optical filters, adhesive sheets, interlayer insulation films, semiconductor insulation protection films, ...

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PUM

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Abstract

This poly(amic acid) composition is obtained by dissolving or dispersing, in a solvent, a poly(amic acid) containing repeating units represented by general formula (A) [in general formula (A), RA and RB are each independently a hydrogen atom or a methyl group, RC is a hydrogen atom, an alkyl group having 1-20 carbon atoms or an alkenyl group having 2-10 carbon atoms, BA is a divalent organic group, B3 and B4 are each independently -C(=O)- or -CH2-, G1 and G2 each independently include at least one type of ring selected from the group consisting of aliphatic rings and aromatic rings or are each independently a straight chain alkane triyl group having 4-10 carbon atoms, and in cases where the number of rings is 2 or more, the rings are a fused ring].

Description

technical field [0001] The present invention relates to a polymer compound having transparency and ultraviolet durability. [0002] The present invention preferably relates to a polyimide molded article excellent in heat resistance, and particularly relates to a material that can be suitably used for forming products or components that require high heat resistance, transparency, and ultraviolet durability ( For example, transparent polyimide films for display device glass substitutes, etc.). Moreover, this invention relates to the polyamic-acid composition and polyimide composition used for manufacturing the said polyimide molding. Background technique [0003] Conventionally, polyimide obtained by polycondensation of tetracarboxylic dianhydride and diamine compound is known as a polymer having excellent heat resistance, physical properties, and chemical resistance, and a low dielectric constant. Based on the above properties, polyimides are used in various applications, a...

Claims

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Application Information

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IPC IPC(8): C08G73/10
CPCC08G73/10C08G73/1046C08G73/1028
Inventor 宫本刚
Owner OSAKA SODA CO LTD
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