Equipment for removing and cleaning liquid on surface of silicon wafer
A technology for cleaning equipment on the surface of silicon wafers, applied to cleaning methods and appliances, cleaning methods using gas flow, electrical components, etc., can solve problems such as residual droplets and failure to meet process requirements, and achieve cost savings and versatility , to avoid the effect of liquid splash
Inactive Publication Date: 2021-11-12
叶建蓉
View PDF11 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, at the same time, there will be liquid droplets remaining on the edge of the back of the silicon wafer, and this cleaning method cannot meet the process requirements
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0027] Such as Figure 1~5 As shown, a silicon chip surface liquid removal and cleaning device of the present invention includes a support frame 1, a rotating disk 2 arranged on the top of the support frame 1, a stepping motor 3 that drives the rotating disk 2 to rotate, and the The negative pressure suction device 5 coaxially arranged on the rotating disk 2, the positive pressure blowing device 48 arranged eccentrically relative to the rotating disk 2, and the support frame 1 is fixed on the base or the ground without shaking. The suction port of the gas device 5 is facing the center of the upper surface of the silicon chip, and its opening is downward so that it can absorb liquid from bottom to top. The air blowing port of the positive pressure blowing device 48 is located at the outer edge of the silicon wafer, blows the liquid on the surface of the silicon wafer obliquely downward, and rotates and blows to the center of the silicon wafer under the drive of the rotating dis...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses equipment for removing and cleaning liquid on the surface of a silicon wafer, and belongs to the technical field of semiconductor chip manufacturing. The equipment for removing and cleaning the liquid on the surface of the silicon wafer comprises a supporting frame, a rotating disc rotationally arranged at the top of the supporting frame, a stepping motor driving the rotating disc to rotate, a negative-pressure air suction device arranged in a mode of being coaxial with the rotating disc and a positive-pressure air blowing device eccentrically arranged relative to the rotating disc, wherein an air suction port of the negative-pressure air suction device right surfaces the center of the upper surface of the silicon wafer; an air blowing port of the positive-pressure air blowing device is located in the edge of the outer side of the silicon wafer; and the positive-pressure blowing device comprises a blowing head assembly, a blowing head deflection assembly and a blowing head position adjusting device. The equipment can remove the residual liquid on the surface of the silicon wafer, so that the stability of the silicon wafer in a machining process is guaranteed, and the quality of the silicon wafer is guaranteed.
Description
technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, and in particular relates to a silicon chip surface liquid removal and cleaning device. Background technique [0002] The silicon wafer transmission subsystem is the main subsystem of the lithography machine, which is mainly responsible for transferring the silicon wafers coated with photoresist in the film warehouse or the uniform film developing machine to the workpiece table for exposure processing, and then transporting the processed silicon wafers to the specify the location. Since in the immersion lithography equipment, the upper surface of the silicon wafer is covered by the immersion liquid during normal production on the workpiece table, the exposed silicon wafer needs to be cleaned. Currently used on the workpiece table of immersion lithography equipment to remove the immersion liquid on the upper surface of the silicon wafer, that is, to remove the liquid on t...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): B08B5/02B08B5/04B08B13/00H01L21/67
CPCB08B5/02B08B5/04B08B13/00H01L21/67028
Inventor 叶建蓉
Owner 叶建蓉