Diffusion automatic chip inserting machine feeding equipment with breakage-proof device

Abstract

The invention discloses diffusion automatic chip inserting machine feeding equipment with a breakage-proof device, and belongs to the technical field of semiconductor processing equipment. The diffusion automatic chip inserting machine feeding equipment comprises a feeding shell and a feeding seat, wherein the feeding shell is fixedly arranged at the top of the feeding seat. According to the diffusion automatic chip inserting machine feeding equipment, a recovery mechanism is arranged below a cleaning mechanism, when the cleaning mechanism is used for cleaning a feeding belt, some cleaned excess materials can directly fall into the recovery mechanism below, through the gradual increase of the pressure, a power transmission gear gives a strong reverse meshing pushing force to a bottom rack, a recovery box is effectively and laterally pushed, the recovery box can be laterally moved to an initial end due to the strong inertia of the recovery box, at the moment, manual recovery can be carried out, the traditional positioning type recovery structure design is abandoned, through the linkage design, the amount of recovered materials can be automatically monitored, meanwhile, the recovered materials can be effectively and rapidly conveyed to the initial end under the condition that a driving source is not needed, manual material conveying is not needed, time and labor are saved, the recovery effect and efficiency are improved, and energy is saved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing equipment, and in particular relates to a diffusion automatic inserting machine feeding equipment with a shatterproof device. Background technique [0002] Semiconductors generally refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductors are widely used in the field of electronic technology. There are semiconductor structural components in many electronic structures. There are many materials that can be used to make semiconductors, such as silicon , germanium, gallium arsenide, etc., and silicon is the most commonly used material. During semiconductor processing, it is often necessary to load raw materials. [0003] Today's feeding equipment does not have a shatterproof structure on it. Generally, multiple materials are loaded at the same time, and the feeding equipment will vibrate when it is running, so that the materials wil...

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Problems solved by technology

[0003] Today's feeding equipment does not have a shatterproof structure on it. Generally, multiple materials are loaded at the same time, and the feeding equipment will vibrate when it is running, so that the materials will collide with each other, resulting in the feeding The material is damaged, and at the same time, in order to clean the belt after feeding, a cleaning brush is often installed in the feeding equipment. After the belt is cleaned, the cleanliness of the belt is improved, but the cleanliness of the device is reduced, and the cleaning brush is used for a period of time. After a period of time, it cannot perform self-cleaning. Some equipment is additionally equipped with a recovery structure to collect some cleaned materials for recycling. However, because the collection end is far away from the output end, and the recovery structure is a positioning design, manual removal is required. Recycling of recycling bins, this process takes a lot of unnecessary time and manpower, which will reduce industrial production efficiency

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