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Thermally conductive silicone potting composition

A technology of thermal conductivity and composition, applied in semiconductor/solid-state device parts, adhesives, electrical components, etc., can solve the problem of unsatisfactory fluidity and difficulty in dispersing into uniformity

Active Publication Date: 2021-11-16
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, prior art hot potting adhesives exhibit good thermal conductivity but have unsatisfactory flowability at room temperature
Moreover, the hot potting adhesives in the prior art have severe filler agglomeration, which is difficult to redisperse into a homogeneous phase

Method used

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  • Thermally conductive silicone potting composition
  • Thermally conductive silicone potting composition
  • Thermally conductive silicone potting composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0131] In fact, there is no particular limitation on the preparation method of the thermally conductive silicone potting composition of the present invention, as long as the method conforms to the conventional method for preparing a two-part thermally conductive silicone potting composition. For example, a thermally conductive silicone potting composition may be prepared by a process comprising mixing components (a), (c), (d), (e), (f) and other components (if desired) together, and mixing together components (b), (c), (d), (e) and other components (if desired), wherein all mixing can be carried out by means of: Tri- Mix, Twin-Mix, Planetary Mixer (all are registered trademarks of mixers of Inoue Mfg., Inc), Ultra Mixer (registered trademarks of mixers of Mizuho Industrial Co., Ltd), Hivis Disper Mix (mixers of PRIMIX Corporation device registered trademark), etc. The mixer used in the present invention may be a planetary mixer manufactured by PC Laborsystem Co., Ltd.

[013...

Embodiment

[0141] The following raw materials were used in the examples.

[0142] Component (a)

[0143] (a-1): VS 20, the structure is [Vi(CH 3 ) 2 SiO 1 / 2 ] 0.091 [(CH 3 ) 2 SiO 2 / 2 ] 0.909 ® vinyl-terminated polydimethylsiloxane manufactured by AB Specialty Silicone Company.

[0144] (a-2): VS 50, the structure is [Vi(CH 3 ) 2 SiO 1 / 2 ] 0.060 [(CH 3 ) 2 SiO 2 / 2 ] 0.940 ® vinyl-terminated polydimethylsiloxane manufactured by AB Specialty Silicone Company.

[0145] (a-3): VS 100, the structure is [Vi(CH 3 ) 2 SiO 1 / 2 ] 0.028 [(CH 3 ) 2 SiO 2 / 2 ] 0.972 ® vinyl-terminated polydimethylsiloxane manufactured by AB Specialty Silicone Company.

[0146] (a-4): VQM2050, the structure is [Vi(CH 3 ) 2 SiO 1 / 2 ] 0.075 [(CH 3 ) 2 SiO 2 / 2 ] 0.425 [SiO 4 / 2 ] 0.5 (R) vinyl-containing polysiloxane manufactured by AB Specialty Silicone Company.

[0147] (a-5): VS 200, the structure is [Vi(CH 3 ) 2 SiO 1 / 2 ] 0.019 [(CH 3 ) 2 SiO 2 / 2 ] 0.981 ® vinyl-terminated po...

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Abstract

The invention discloses a thermally conductive silicone potting composition. The thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 [Mu]m and less than 3 [Mu]m, (d) an alumina and / or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 [Mu]m and less than 15 [Mu]m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 [Mu]m and less than or equal to 100 [Mu]m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c), (d) and (e). The thermally conductive silicone potting composition shows a good balance among flowability, thermal conductivity and storage stability. A thermal potting adhesive, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component are further disclosed.

Description

technical field [0001] The invention relates to a thermally conductive silicone potting composition. In particular, the present invention relates to a two-part thermally conductive silicone potting composition. Background technique [0002] With the rapid development of electronic technology and integrated assembly technology, electronic components and logic gates, which are closely related to people's lives, tend to be miniaturized, and correspondingly, such devices will generate a lot of heat. If the heat generated in electronic equipment is high, it is easy to cause fire safety accidents and damage to electronic products. To quickly conduct and dissipate heat and protect vulnerable parts from damage (e.g., external light, moisture, dust, radiation, and shock), hot potting adhesives require a good combination of properties, including flow, thermal conductivity, and storage stability. [0003] However, prior art hot potting adhesives exhibit good thermal conductivity but...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K3/22
CPCC08L83/04C08K2201/014C08K2003/2227C08K2201/003H01L23/296H01L23/3737C08G77/12C08G77/20C09J183/04C08K3/22C08L83/00C08K5/54C08G77/08C08G77/70C08K2201/001C08L2203/20
Inventor 邢文涛Y·王武豪邱雪宇张新玉X·朱
Owner HENKEL KGAA