Manufacturing method of CMP diamond dresser

Abstract

The invention discloses a manufacturing method of a CMP diamond dresser. The manufacturing method comprises the following steps of step 1, cleaning; step 2, coating; step 3, plating; step 4, screening; step 5, tiling; step 6, covering a film; step 7, removing the film; wherein in the first step, firstly, a stainless steel substrate is cleaned; wherein in the step 2, photoresist is coated on the stainless steel substrate, patterning is carried out by utilizing a photoetching technology, and the photoresist is reserved on a required pattern; and in the step 3, a PVD method is used for replacing an electroplating method for coating and fixing diamond. According to the manufacturing method of the CMP diamond dresser provided by the invention, the production steps are greatly reduced; when an electroplating method is used for preparation, multiple times of electroplating and detection are needed, the production time is fully shortened, the production efficiency is improved by changing the time and power and optimizing the process to adjust the microstructure and control the thickness and components of the film through the PVD method, and the PVD method is more friendly to the environment, free of pollution, low in material consumption, uniform and compact in film forming and high in binding force with a base body, and the fixing effect on the diamond is better.

Description

technical field [0001] The invention relates to the technical field of a CMP diamond dresser, in particular to a manufacturing method of a CMP diamond dresser. Background technique [0002] With the rapid development of the semiconductor industry, electronic devices tend to be miniaturized gradually, the resolution requirements of photolithography technology are getting higher and higher, and the flatness of the wafer surface needs to reach the nanometer level. When the size reaches below 0.35μm, global planarization must be achieved. Chemical Mechanical Polishing (CMP) is a planarization technology that is outstanding in both current and future manufacturing. It can meet the processing requirements of silicon wafer graphics in terms of processing performance and speed, effectively reduce defect density, and improve yield , so it has been widely used in the semiconductor manufacturing industry to polish semiconductor wafers to obtain a mirror finish. [0003] During CMP, t...

AI Technical Summary

Problems solved by technology

Since electroplating cannot achieve chemical bonding, the bonding between diamond particles and the matrix is ​​only mechanical bonding. The electroplating method relies on the mechanical engagement with the bonding agent caused by particle roughness and irregularity to achieve this. The force is limited, and the diamond is easy to fall off from the nickel coating, thus scratching the wafer

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