Resin removing device and removing method thereof

A technology for removing device and resin, which is applied in the field of resin, can solve the problems of insufficient intelligence, etc., and achieve the effect of easy separation and intelligent cleaning process

Pending Publication Date: 2021-11-19
GUANGZHOU HEIGE ZHIZAO INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a resin removal device and its removal method, which aims to solve the problem that the existing equipment is not intelligent enough in the process of processing

Method used

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  • Resin removing device and removing method thereof
  • Resin removing device and removing method thereof
  • Resin removing device and removing method thereof

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Embodiment

[0045] In photocuring printing, the 3D data model is first sliced ​​to obtain multiple slice layers, and then the light source projects light on the photosensitive resin according to the shape and thickness of the slice layer, so that the photosensitive resin is cured into the entity corresponding to the slice layer Cured layer, the cured layer is directly formed on the printing platform, and after layer-by-layer stacking, a three-dimensional solid model is finally obtained. But obviously, excess resin will adhere to the surface of the printed 3D solid model, and the excess resin needs to be removed.

[0046] Such as figure 1 as shown, figure 1 It is a structural schematic diagram of a resin removal device and its removal method disclosed in the embodiment of the application; the application provides a resin removal device for removing excess resin on the surface of a three-dimensional solid model (ie, the part to be removed 400 ) printed by a printer Clearing, which include...

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PUM

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Abstract

The invention provides a resin removing device and a removing method thereof, and relates to the technical field of resin. The resin cleaning device comprises a control system, a treatment assembly and a feedback component, wherein the treatment assembly comprises a treatment device and a driving device, the treatment device is provided with a containing cavity for containing a to-be-cleaned piece, the to-be-cleaned piece is connected with the driving device, and / or the treatment device is connected with the driving device, the driving device is in communication connection with the control system, the treatment device is used for reducing the viscosity of resin on the to-be-cleaned piece, and the feedback component is used for acquiring the position information of the to-be-cleared part and feeding back the position information to the control system. According to the resin cleaning device, the control system can control the driving device to drive the to-be-cleaned piece to rotate in the circumferential direction, so that most of redundant resin on the to-be-cleaned piece is thrown away, then under the action of the feedback assembly, the control system intelligently adjusts the position of the to-be-cleaned piece, and after viscosity reduction treatment of the treatment device, the resin of the to-be-cleaned part can be thrown away more easily, and a more intelligent cleaning technological process is achieved.

Description

technical field [0001] The present application relates to the technical field of resin, in particular, to a resin removal device and a method for removing resin. Background technique [0002] The 3D technology of photocuring molding is to use the liquid photosensitive to undergo polymerization reaction under the irradiation of ultraviolet light, and change from liquid to solid. The forming principle is to slice the obtained 3D data model along the Z-axis direction according to the set layer thickness through the control software to obtain the cross-sectional data of each area of ​​the 3D data model, and then control the ultraviolet laser according to the cross-sectional data. Scan the liquid level of the liquid photosensitive resin, or control the ultraviolet light projector to project the light spot in the shape of the cross-sectional data to the liquid level of the photosensitive resin, and further, the liquid photosensitive resin scanned by the ultraviolet laser or irradi...

Claims

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Application Information

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IPC IPC(8): B29C64/35B33Y40/20
CPCB29C64/35B33Y40/20
Inventor 陈彪万欣左黎隽胡骏喻佳邹陈来
Owner GUANGZHOU HEIGE ZHIZAO INFORMATION TECH CO LTD
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