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Isolated packaging self-compensation resonance pressure sensitive chip probe and packaging method thereof

A sensitive chip, self-compensating technology, applied in the measurement of fluid pressure, decorative arts, measurement devices, etc., can solve the problems of decreased measurement accuracy and long-term stability, affecting measurement accuracy and application range, low Q value, etc. The effect of stability, improved accuracy, and increased reliability

Pending Publication Date: 2021-11-26
NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problem of low Q value and temperature drift in the existing resonant pressure sensitive chip, which affects its measurement accuracy and application range, and the problem of measurement accuracy and long-term stability decline in the existing packaging method

Method used

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  • Isolated packaging self-compensation resonance pressure sensitive chip probe and packaging method thereof
  • Isolated packaging self-compensation resonance pressure sensitive chip probe and packaging method thereof
  • Isolated packaging self-compensation resonance pressure sensitive chip probe and packaging method thereof

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specific Embodiment approach 1

[0057] Specific implementation mode one: combine Figure 1 to Figure 8 Describe this embodiment mode, an isolated package self-compensation resonant pressure sensitive chip probe of this embodiment mode, which includes a pressure ring 1, a corrugated diaphragm 2, a silicon resonant pressure sensitive chip 3, a Kovar pin 4, and an electrode bonding wire 5. Two probe medium transmission channels 6, sealing tube base 7 and isolation medium 8,

[0058] The upper end surface of the sealing tube base 7 is a corrugated diaphragm contact surface 701, and a stepped groove is provided on the corrugated diaphragm contact surface 701, the upper stepped surface of the stepped groove is the lead hole surface 704, and the lower stepped surface is the chip bonding surface 702, two probe medium transmission channels 6 are opened on the chip bonding surface 702, a plurality of lead holes 703 are vertically opened on the lead hole surface 704, and the middle and upper part of the outer cylindric...

specific Embodiment approach 2

[0064] Specific implementation mode two: combination Figure 4 To illustrate this embodiment, a pressure-sensitive via hole 3031 is provided between two adjacent stress isolation layers 303 and directly below the pressure silicon-based substrate 3021-1 in this embodiment. Such arrangement enables the medium pressure to be transmitted to the resonant layer 302 accurately. Other components and connections are the same as those in the first embodiment.

specific Embodiment approach 3

[0065] Specific implementation mode three: combination Figure 4 To illustrate this embodiment, a temperature-sensing via hole 3032 is provided between two adjacent stress isolation layers 303 and directly below the temperature silicon-based substrate 3021-2 in this embodiment. Such setting facilitates the transmission of pressure to the silicon-based substrate 3021 and then to the resonant layer 302 to achieve the purpose of pressure sensing. Other compositions and connections are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses an isolation packaging self-compensation resonance pressure sensitive chip probe and a packaging method thereof, and relates to a probe and a packaging method thereof. The invention aims to solve the problems of low Q value, temperature drift and reduction of measurement precision and long-term stability of the existing resonant pressure sensitive chip. Kovar alloy pins are installed on lead holes, silicon resonance pressure sensitive chips are double chips and are installed on a chip bonding surface, a gap is reserved between the silicon resonance pressure sensitive chips and the Kovar alloy pins, and the silicon resonance pressure sensitive chips are connected with the Kovar alloy pins through electrode bonding leads. The corrugated diaphragm is mounted on the corrugated diaphragm contact surface, the compression ring is pressed on the corrugated diaphragm, and the isolation medium is filled in a closed cavity formed among the gap, the probe medium transfer channel, the corrugated diaphragm and the sealing tube seat. According to the packaging method, secondary packaging is carried out on the resonance layer, so that the silicon resonance pressure sensitive chip works in the isolation medium. The method is used for pressure measurement and packaging of the pressure chip probe.

Description

technical field [0001] The invention relates to a self-compensation resonant pressure-sensitive chip probe and a packaging method thereof, in particular to an isolated package self-compensation resonant pressure-sensitive chip probe, which belongs to the field of MEMS resonant pressure sensors. Background technique [0002] The silicon resonant pressure sensor indirectly measures the pressure by measuring the natural frequency variation of the resonant chip. The accuracy is 1-2 orders of magnitude higher than that of the general pressure sensor. It works reliably and has good stability and repeatability. [0003] The traditional silicon resonant pressure transmitter realizes pressure measurement by directly contacting the measured pressure, which is suitable for high-precision pressure measurement of clean gas; The resonant pressure sensor works in a corrosion state for a long time, which may easily lead to structural damage of the silicon resonant pressure probe and corrosi...

Claims

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Application Information

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IPC IPC(8): B81B7/00B81B7/02B81C1/00G01L27/00
CPCB81B7/0032B81B7/0035B81B7/0058B81B7/007B81B7/02B81C1/00261B81C1/00277B81C1/00301G01L27/005B81B2201/0264Y02P70/50
Inventor 刘兴宇孙权孟宪宁石庆国夏露李修钰
Owner NO 49 INST CHINESE ELECTRONICS SCI & TECH GRP
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