Micro-etching processing technology for resin plug hole of dry film cover

Abstract

The invention relates to the technical field of circuit board processing, in particular to a dry film cover resin plug hole micro-etching processing technology. The technology comprises the following steps: directly windowing on a graphic resin plug hole, pasting films on two sides of a board surface, exposing the two sides of the board surface, performing copper reduction on a board at a micro-etching line after determining that a dry film completely covers the position of the resin plug hole, determining that the resin hole plugging position is not corroded, after the plate surface is ground to be flat, developing an outer layer by adopting data of small-size line width/line spacing, a positive film and double-sided exposure data, and after determining that the line width, the line spacing, the BGA, the IC and the MI are consistent, turning to the next process for production. According to the method, hole copper of the resin plug hole can be effectively prevented from being etched in the micro-etching copper reduction process by covering the hole covering dry film on the resin plug hole, the hole opening quality is good, the requirement for manufacturing a circuit board with small line width/line distance can be met, and the effect is good.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing technology for micro-etching of resin plug holes of a dry film cover. Background technique [0002] With the continuous miniaturization and portability of many electronic products, the functions of electronic products are increasing again and again, which makes the size of PCB in electronic products smaller and smaller, the wiring density is getting denser and the line width of high-precision difficult boards is getting smaller and smaller, Resin plug holes + high copper thickness cannot meet the requirements for etching 3 / 3mil line width and line spacing, and direct micro-etching will cause quality risks to the openings where the resin plug holes are not full, such as uneven openings, lack of copper at the openings, etc. question. [0003] In the early stage, the inventor produced circuit boards with a line width / space of 3 / 3 mil without a micro-et...

AI Technical Summary

Problems solved by technology

[0002] With the continuous miniaturization and portability of many electronic products, the functions of electronic products are increasing again and again, which makes the size of PCB in electronic products smaller and smaller, the wiring density is getting denser and the line width of high-precision difficult boards is getting smaller and smaller, Resin plug holes + high copper thickness cannot meet the requirements for etching 3 / 3mil line width and line spacing, and direct micro-etching will cause quality risks to the openings where the resin plug holes are not full, such as uneven openings, lack of copper at the openings, etc. question

[0003] In the early stage, the inventor produced circuit boards with a line width / space of 3 / 3mil without a micro-etching process, which could not meet the requirements at all.

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