Purple picosecond laser cutting method for cutting LCP (Liquid Crystal Polymer) material

Abstract

The invention belongs to the technical field of LCP material processing methods, and particularly relates to a purple picosecond laser cutting method for cutting an LCP material. The purple picosecond laser cutting method for cutting the LCP material comprises the following steps of: measuring the thickness of the to-be-cut LCP material; according to the thickness of the to-be-cut LCP material and the output parameters of a laser device, calculating the cutting frequency and the single cutting time; and controlling the laser device to output corresponding laser beams to the LCP material successively according to set output parameters, the cutting frequency and the single cutting time, and moving the focus positions of the laser beams by a corresponding distance towards the center of the LCP material after each cutting. According to the purple picosecond laser cutting method, the LCP material is cut through the laser device, the corresponding thickness is cut each time, and cutting is completed multiple times; for the thick LCP material, the focus positions are changed after cutting each time, and the focus positions gradually move from the surface of the LCP material to the center of the LCP material; and the single laser pulse width and the laser repetition frequency are changed, so that smoke dust generation is restrained, and smoke dust attachment on a cutting surface is reduced.

Description

technical field [0001] The invention belongs to the technical field of LCP material processing methods, and in particular relates to an ultraviolet picosecond laser cutting method for cutting LCP materials. Background technique [0002] Liquid crystal polymers (LCP materials) are highly crystalline, thermotropic (melt oriented) thermoplastics with high rigidity and low coefficient of thermal expansion in thin-walled sections. The LCP material is composed of rigid rod-shaped polymers, which are linearly arranged to form a liquid crystal structure during the melting process, and can withstand surface mount soldering temperatures including soldering. If it is reinforced with glass fiber, carbon fiber, etc., it is far more than other engineering plastics. These properties make LCP materials ideal for electronic applications such as sockets, bobbins, switches, connectors, chip carriers and sensors. Many grades outperform ceramics, thermosets and other high temperature plastics....

AI Technical Summary

Problems solved by technology

[0003] While having excellent performance, it also adds difficulties to the manufacturing process

For example, the cutting process of some special shapes, cutting with traditional knives, has low efficiency, poor precision and large deformation

Cutting with the traditional laser cutting process, some processes cannot be cut; some cutting processes will cause serious deformation of the material;

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