Unlock instant, AI-driven research and patent intelligence for your innovation.

Mini-LED device, LED display module and manufacturing method thereof

A manufacturing method and display module technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of low die-bonding yield rate, general display quality, and low contrast, so as to reduce equipment investment and improve display Quality, fast results

Pending Publication Date: 2021-12-07
HCP TECH CO LTD
View PDF49 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a Mini-LED device, an LED display module and a manufacturing method thereof, so as to solve the problems of low die-bonding yield, low contrast, and general display quality in the existing LED display production process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mini-LED device, LED display module and manufacturing method thereof
  • Mini-LED device, LED display module and manufacturing method thereof
  • Mini-LED device, LED display module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] In order to make the object, technical solution and beneficial effects of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0054] In order to illustrate the technical solutions of the present invention, specific examples are used below to illustrate.

[0055] see Figure 1 to Figure 11 , a manufacturing method of a Mini-LED device provided in an embodiment of the present invention,

[0056] Include the following steps:

[0057] S1: Adhere the LED chip 200 to the lower surface of the glass plate 101 by means of thimble transfer;

[0058] S2: Press the LED chip 200 glued to the glass plate 101 on the substrate 100, and fix the LED chip 200 on the substrate 100 by laser crystal bonding; first press the LED c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of LEDs, in particular to a Mini-LED device, an LED display module and a manufacturing method of the Mini-LED device. The method comprises the following steps of S1, adhering an LED chip to the lower surface of a glass plate in an ejector pin transfer mode; s2, pressing the LED chip adhered to the glass plate on a substrate, and fixing the LED chip on the substrate through laser die bonding; s3, the substrate is bonded to the upper surface of the carrier plate for mold pressing, and LED chip packaging is completed; s4, cutting the substrate which is molded on the carrier plate, and segmenting the substrate into single Mini-LED devices; and S5, carrying out spot measurement sorting on the segmented single Mini-LED device, and fixing the segmented single Mini-LED device on a blue film. The LED chips can be rapidly transferred through the ejector pin transferring method, positioning is accurate, the transferred LED chips do not need to be subjected to spot measurement sorting in advance, and spot measurement sorting is carried out after packaging; therefore, according to the Mini-LED device, the LED display module and the manufacturing method of the Mini-LED device, the die bonding precision is improved, the cost is reduced, and the display quality and the yield of the Mini-LED device are improved.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a Mini-LED device, an LED display module and a manufacturing method thereof. Background technique [0002] The LED industry is one of the most active industries today, and LED display products have gradually entered various fields of social life. At the same time, with the innovation and development of LED display technology, the small-pitch LED display module with high resolution per unit area has become the mainstream product of LED display, which can display higher-definition graphics, images and videos. It can display more video and image images, especially in the application of image stitching, which can achieve arbitrary large-area stitching. [0003] In the current production process of LED display, there are two kinds, one is COB (chip on board) and the other is SMD (surface mounted device); it is generally believed that COB has the best display effect, but the existing pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/00H01L21/66H01L21/67H01L25/075
CPCH01L33/0093H01L21/67271H01L22/20H01L25/0753
Inventor 李星孙明庄文荣
Owner HCP TECH CO LTD