Mounting and manufacturing process of intelligent wireless communication equipment device

Abstract

The invention provides a mounting and manufacturing process of an intelligent wireless communication equipment device, and relates to the technical field of intelligent wireless communication equipment production. The mounting and manufacturing process of the intelligent wireless communication equipment device comprises the following steps of S1, injection molding, specifically, putting a mixed copper liquid into a molding cavity, extruding the copper liquid in the molding cavity and keeping for a period of time, cooling and molding the copper liquid in the molding cavity, and taking out the copper liquid to obtain the injection-molded heat dissipation cylinder; and S2, cutting and grooving, specifically, conducting cutting and grooving on the surface of the heat dissipation cylinder subjected to injection molding in the step S1. According to the mounting and manufacturing process, through the machining procedures completed in sequence, the production quality of a heat dissipation device can be effectively improved, burrs on the surface of the formed heat dissipation device can be reduced, particularly, the effective removal rate of the burrs on the edge of a grooved heat dissipation blade can reach 90% or above, through rapid reversing of a steering assembly, whole-process machining is achieved without manual operation, the production and machining safety is improved, and the machining efficiency of the heat dissipation device is improved.

Description

technical field [0001] The invention relates to the technical field of production of intelligent wireless communication equipment, in particular to a process for installing and manufacturing components of intelligent wireless communication equipment. Background technique [0002] Communication equipment, referred to as ICD in English, is used for wired communication equipment and wireless communication equipment in industrial control environments. Wireless communication equipment mainly includes wireless APs, wireless bridges, wireless network cards, wireless lightning arresters, wireless cameras, antennas, mobile phones, computers and other electronic equipment. [0003] When any kind of wireless communication equipment is working, the components will generate heat, which requires the application of heat dissipation devices to dissipate heat from electronic components. Common heat dissipation devices include heat pipes, cooling fans, and heat sinks specially designed for spe...

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Problems solved by technology

[0004] Aiming at the problems in the prior art, the purpose of the present invention is to provide a device installation and manufacturing process for intelligent wireless communication equipment, which solves the existing problem. In order to improve the heat dissipation effect, several equal-spaced distribution holes are often provided on the outer surface of the heat dissipation cylinder. The heat sink, through the gap inside the heat sink, increases the rapid diffusion speed of the temperature, and for the production of the heat sink on the outer surface of the heat sink, in the prior art, cutting or hobbing is often used to realize the production of the heat sink , such a processing method has technical problems such as slow processing efficiency and inconsistent structural features of the heat sink

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