Automatic glue coating and spinning device for semiconductor silicon wafer and key structure of automatic glue coating and spinning device

Abstract

The invention discloses an automatic glue coating and spinning device for a semiconductor silicon wafer and a key structure of the automatic glue coating and spinning device. The automatic glue coating and spinning device comprises a machine body, a mounting frame, a PLC, a human-computer interface, a glue spinning assembly, a glue dripping assembly and a high-speed vacuum suction assembly, wherein the mounting frame is fixedly connected to one side of the machine body, the glue dripping assembly is fixedly connected to the top side of the mounting frame, the glue spinning assembly is arranged on the bottom side of the glue dripping assembly, the high-speed vacuum suction assembly is arranged in the glue rotating assembly, the glue spinning assembly comprises a lifting air cylinder, a lifting plate, a silicon wafer, a glue thickness measuring sensor, a guide column and a connecting frame, the glue dripping assembly comprises a horizontal air cylinder, a vertical air cylinder, a glue dripping valve, a pressure regulating valve, a glue pressure tank, a glue discharging container and a fixing frame, and the high-speed vacuum suction assembly comprises a suction cup, a high-speed cyclone component, a speed increaser and a motor. The automatic glue coating and spinning device for the semiconductor silicon wafer is novel in design and simple in structure, meets the requirement of high rotating speed through the small-torque motor, and can ensure that the silicon wafer is stably connected at the high rotating speed.

Description

Technical field [0001] The present invention relates to a semiconductor wafer automatic coating rubber device and a key structure thereof, belonging to the semiconductor wafer automatic coating glue application technology. Background technique [0002] During the semiconductor chip lithographic production process, the silicon wafer needs to be surface cleaning, cast, spin coated photoresist, soft baking, cooling, etc., the spin coated photoresist is an important part; in the spin In the coated gel, there are two process methods; one is static coating, i.e. silicon is stationary, drip, accelerated rotation, glue, volatile solvent; the other is dynamic rubber, ie low speed rotation (500R) / min), drip, accelerated rotation (5000R / min), glue, volatile solvent : The viscosity of the photoresist, the lower the viscosity, the thinner thickness of the photoresist; the speed of rotation, the speed is, the thickness is thin; the speed of rotation, the faster the acceleration, the more u...

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Problems solved by technology

[0003] At present, there are many problems in the process of using the automatic glue coating and rejection device for semiconductor silicon wafers, such as the high speed, high torque, and vacuum adsorption compatibility of large-size silicon wafers. The classic method of silicon wafer adsorption and rejection is that the vacuum air circuit passes through the motor. The bottom, the hollow shaft of the motor, the silicon wafer suction cup, and the silicon wafer are connected together. The silicon wafer is firmly adsorbed on the silicon wafer suction cup by vacuum suction, and then the motor rotates at a high speed to drive the silicon wafer to rotate and apply glue; the silicon wafer size ( 8 inches, diameter 200mm), high speed (5000r / min), according to the torque calculation formula, it can be seen that the starting torque to drive the silicon wafer to rotate at high speed is 0.3N m, plus the safety factor, friction, etc., the required motor torque is 0.8 More than N m, the domestic conventional hollow motor can reach the speed, but the motor torque is very small (0.1 N m); the motor torque can meet the requirements, but the motor shaft is a solid shaft, and the rated speed is 3000r / min, which cannot Meet the use

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