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Organic light-emitting display panel and electronic equipment

A light-emitting display, organic technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of abnormal display, offset or widening of Frit glue, melting, etc., to achieve the effect of ensuring sintering effect and improving product yield

Active Publication Date: 2021-12-28
BOE TECH GRP CO LTD +1
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0003] However, during the sintering process after the Frit glue is printed, if the design or process Margin (blank space) is insufficient, it will cause the Frit glue to shift or widen, which will cause the nearby SD signal lines (that is, the source signal line and the drain The signal line) melts, causing the SD signal line to be short-circuited with the frit sub (that is, the metal layer corresponding to the Frit glue packaging area), causing abnormal display and affecting device performance

Method used

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  • Organic light-emitting display panel and electronic equipment
  • Organic light-emitting display panel and electronic equipment
  • Organic light-emitting display panel and electronic equipment

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Embodiment Construction

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0025] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are o...

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Abstract

The embodiment of the invention provides an organic light-emitting display panel and electronic equipment. The organic light-emitting display panel at least comprises an energy absorption layer, a cover plate, a packaging adhesive layer and a display substrate which are arranged in sequence, wherein the organic light-emitting display panel comprises a display area and a peripheral area, and the packaging adhesive layer is arranged in the peripheral area and surrounds the display area; the energy absorption layer is arranged on the cover plate, the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the packaging adhesive layer on the cover plate, and the energy absorption layer is used for absorbing heat energy in the laser sintering process. According to the embodiment of the invention, the structure of the cover plate is improved, the energy absorption layer is arranged on the cover plate, and the orthographic projection of the energy absorption layer on the cover plate covers the orthographic projection of the packaging adhesive layer on the cover plate, so that a part of heat energy in the laser sintering process can be taken away during laser sintering, the sintering effect is ensured, the problems of short circuit between the SD signal line and the frit sub and the like caused by deviation and widening of the packaging adhesive layer are solved.

Description

technical field [0001] The present disclosure relates to the display field, in particular to an organic light emitting display panel and electronic equipment. Background technique [0002] Frit packaging (that is, glass frit packaging) is a packaging method used in AMOLED (that is, active matrix organic light-emitting diode) products. After the packaging is completed, the laser (laser sintering) process is carried out. The purpose is to combine TSP (cover plate) and BP (back plate) ) pasted together to prevent the gas and water vapor in the air from entering the screen and affecting the evaporation material. [0003] However, during the sintering process after the Frit glue is printed, if the design or process Margin (blank space) is insufficient, it will cause the Frit glue to shift or widen, which will cause the nearby SD signal lines (that is, the source signal line and the drain The signal line) is melted, causing the SD signal line to be short-circuited with the frit s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L27/32
CPCH10K59/12H10K50/80H10K50/84Y02E10/549
Inventor 金文强唐亮李子华蔡璐徐国芳徐东刘乐王旭东王旭郭强景国栋李春波张瑞卿王强
Owner BOE TECH GRP CO LTD
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