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A kind of gold alloy and alloy product and preparation method thereof

A gold alloy and alloy technology, which is applied in the field of semiconductor packaging, can solve the problems of easy corrosion and vulcanization, high price and high wire breakage rate, and achieve the effects of slow growth, improved mechanical properties and reduced wire breakage rate.

Active Publication Date: 2022-03-08
北京达博有色金属焊料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome that the bonding wire in the prior art is easy to corrode and vulcanize during the annealing production and wire bonding process, still needs protective gas protection, high wire interruption rate in the drawing process, and high price. Expensive defects, thereby providing a gold alloy connecting wire and its manufacturing method

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  • A kind of gold alloy and alloy product and preparation method thereof

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Effect test

Embodiment 1

[0068] This embodiment provides a gold alloy connecting wire, which contains: Ag 25%, Pd 5%, Cu 2%, trace elements Eu 15ppm, Ge 35ppm, Ti 50ppm, Sc 20ppm, and the balance is gold.

[0069] The preparation method of above-mentioned gold alloy connecting wire is as follows figure 1 shown, including the following steps:

[0070] S1. Preparation of master alloy: mix 0.15gEu with 18.25g gold powder, 0.35gGe with 43.4g gold powder, 0.5gTi with 62g gold powder, 0.2gSc with 24.8g gold powder, and make each trace element mass content 0.8%. A variety of intermediate alloy raw materials; put various intermediate alloy raw materials into high-purity graphite crucibles, and then place the high-purity graphite crucible in a high-frequency induction alloy furnace, in a vacuum state (vacuum degree: 5.0×10 -3 Pa) heated to 1050°C, 1060°C, 1110°C, 1100°C respectively to melt the above-mentioned various intermediate alloy raw materials, and then fully stir, the stirring speed is 20s / time, and t...

Embodiment 2

[0081] This embodiment provides a gold alloy connecting wire, which contains: Ag 20%, Pd 10%, Cu3%, trace elements Ti 50ppm, Y 50ppm, Ge 80ppm, Sc 30ppm, Eu30, Zr50ppm in mass percentage, and the balance is gold.

[0082] The preparation method of the above-mentioned gold alloy connecting wire comprises the following steps:

[0083] S1. Master alloy preparation: 0.5gTi mixed with 49.5g gold powder, 0.5gY mixed with 49.5g gold powder, 0.8gGe mixed with 79.2g gold powder, 0.3gSc mixed with 29.7g gold powder, 0.3gEu mixed with 29.7g gold powder, 0.5gZr mixed with 49.5 G gold powder is mixed to make various master alloy raw materials with 1% mass content of each trace element; put all kinds of master alloy raw materials into high-purity graphite crucibles, and then put the high-purity graphite crucibles into high-frequency induction alloy furnaces , in a vacuum state (vacuum degree: 5.0×10 -3 Pa) heated to 1110°C, 1100°C, 1060°C, 1100°C, 1050°C, 1200°C respectively to melt the a...

Embodiment 3

[0094] This embodiment provides a gold alloy connecting wire, which contains: Ag 15%, Pd 8%, Cu 1%, trace elements Ti 30ppm, Y 30ppm, Sc 10ppm, Zr 10ppm, and the balance is gold.

[0095] The preparation method of the above-mentioned gold alloy connecting wire comprises the following steps:

[0096] S1. Preparation of master alloy: 0.3gTi mixed with 59.7g gold powder, 0.3gY mixed with 59.7g gold powder, 0.1gSc mixed with 19.9g gold powder, 0.1gZr mixed with 19.9g gold powder, and made into each trace element mass content of 0.5%. A variety of intermediate alloy raw materials; put various intermediate alloy raw materials into high-purity graphite crucibles, and then place the high-purity graphite crucible in a high-frequency induction alloy furnace, in a vacuum state (vacuum degree: 5.0×10 -3 Pa) heated to 1110°C, 1100°C, 1100°C, 1200°C respectively to melt the above-mentioned various intermediate alloy raw materials, then fully stir (speed: 20s / time, time: 15min) to fully fuse...

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Abstract

The invention provides a gold alloy and an alloy product and a preparation method thereof, which belong to the technical field of semiconductor packaging, and solve the problem that the bonding wires in the prior art are easy to corrode and sulfide during annealing production and wire bonding, and still need to be protected. Gas protection, the defects of high line break rate and high price during the drawing process. The gold alloy of the present invention includes Ag 10%-25%, Pd 3%-10%, Cu 0.5%-3% and trace elements 10-500 ppm in mass percentage, and the balance is gold; the trace elements include selected from One or more first trace elements selected from Al, Ti, Y, Zn, one or more second trace elements selected from La, Ge, Sc, Sn and selected from Ba, Eu, Mn, One or more third trace elements in Zr. The alloy connecting wire prepared by the gold alloy of the present invention is not easy to break during the drawing process, and can complete wire bonding without protective gas during use.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a gold alloy and an alloy product and a preparation method thereof. Background technique [0002] Bonding wire is one of the key materials of semiconductor packaging. It serves as the main connection material between the chip and the external circuit for signal transmission, and plays the role of current conduction between the chip and the external circuit. Wire bonding is a critical link in its packaging process. [0003] The gold wire in the bonding wire has strong corrosion resistance and high reliability, and is widely used in mid-to-high-end products in the electronic packaging industry. However, gold wires are expensive to manufacture. In order to reduce packaging costs, various gold wire substitutes have been launched on the market. Among them, bonding copper wire has been used as a substitute material for gold wire, but due to its high hardne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/02C22C1/03C22F1/14C22C1/06B21C37/04
CPCC22C5/02C22C1/03C22F1/14C22C1/06B21C37/04
Inventor 刘洁闫茹张虎田柳
Owner 北京达博有色金属焊料有限责任公司