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Gold alloy, alloy product and preparation methods thereof

A gold alloy and alloy technology, applied in the field of semiconductor packaging, can solve the problems of high price, easy corrosion and vulcanization, high disconnection rate, etc., and achieve the effects of improving mechanical properties, slow growth, and reducing disconnection rate

Active Publication Date: 2021-12-31
北京达博有色金属焊料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome that the bonding wire in the prior art is easy to corrode and vulcanize during the annealing production and wire bonding process, still needs protective gas protection, high wire interruption rate in the drawing process, and high price. Expensive defects, thereby providing a gold alloy connecting wire and its manufacturing method

Method used

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  • Gold alloy, alloy product and preparation methods thereof

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Effect test

Embodiment 1

[0068] The present embodiment provides a gold alloy wire is connected, containing, in mass percent: Ag 25%, Pd 5%, Cu 2%, trace element Eu 15ppm, Ge 35ppm, Ti 50ppm, Sc 20ppm, and residual Au.

[0069] Method for preparing the gold alloy wire connection such as figure 1 As shown, including the following steps:

[0070] Sl, intermediate alloy prepared: The 0.15gEu powder mixed with 18.25g, 0.35gGe powder mixed with 43.4g 0.5gTi powder mixed with 62g, 0.2gSc powder mixed with 24.8 g of, each of the dubbed content of 0.8% by mass of each microelement intermediate species alloy materials; various alloy materials were placed in the middle of high purity graphite crucible, and then high-purity graphite crucible was placed in an alloy high-frequency induction furnace in a vacuum state (degree of vacuum: 5.0 × 10 -3 Pa) was heated to 1050 ℃, 1060 ℃, 1110 ℃, 1100 ℃, so that the various intermediate melting alloy materials, and then sufficiently stirred, the stirring speed 20s / time, mixin...

Embodiment 2

[0081] The present embodiment provides a gold alloy wire is connected, containing, in mass percent: Ag 20%, Pd 10%, Cu3%, trace elements Ti 50ppm, Y 50ppm, Ge 80ppm, Sc 30ppm, Eu30, Zr50ppm, balance gold.

[0082] The method of preparation of the above gold alloy wire connector comprising the steps of:

[0083] Sl, intermediate alloy prepared: 0.5gTi mixed with powder 49.5g, and 49.5g 0.5Gy 0.8gGe mixed powder was mixed with powder 79.2g, 0.3gSc powder mixed with 29.7g, 0.3gEu powder mixed with 29.7g, 0.5gZr and 49.5 g mixed powder, dubbed content of 1% by mass of each of the trace elements among the various alloy materials; various alloy materials were placed in the middle of high purity graphite crucible, and then high-purity graphite crucible was placed in a high frequency induction furnace alloy , in a vacuum state (degree of vacuum: 5.0 × 10 -3 After Pa) was heated to 1110 ℃, 1100 ℃, 1060 ℃, 1100 ℃, 1050 ℃, 1200 ℃, so that the various intermediate melting alloy material, suff...

Embodiment 3

[0094] The present embodiment provides a gold alloy wire connection, comprising, by mass percentage: Ag 15%, Pd 8%, Cu 1%, trace elements Ti 30ppm, Y 30ppm, Sc 10ppm, Zr10ppm, and residual Au.

[0095] The method of preparation of the above gold alloy wire connector comprising the steps of:

[0096] Sl, intermediate alloy prepared: 0.3gTi powder was mixed with 59.7g, 0.3gY powder mixed with 59.7g 0.1gSc powder mixed with 19.9g, 0.1gZr powder mixed with 19.9 g of, dubbed each trace element content of 0.5% by mass of each of the intermediate species alloy materials; various alloy materials were placed in the middle of high purity graphite crucible, and then high-purity graphite crucible was placed in an alloy high-frequency induction furnace in a vacuum state (degree of vacuum: 5.0 × 10 -3 After Pa) was heated to 1110 ℃, 1100 ℃, 1100 ℃, 1200 ℃, so that the various intermediate melting alloy material, sufficiently stirring (speed: 20s / times, Time: 15min) the alloy sufficiently fuse...

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Abstract

The invention provides a gold alloy, an alloy product and preparation methods thereof, and belongs to the technical field of semiconductor packaging. The defects that in the prior art, a bonding wire is prone to corrosion and vulcanization in the annealing production and wire bonding process, protection gas protection is still needed, the wire breaking rate is high in the drawing process, and the price is high are overcame. The gold alloy comprises the components of, in percentage by mass, 10%-25% of Ag, 3%-10% of Pd, 0.5%-3% of Cu, 10-500 ppm of trace elements, and the balance gold; and the trace elements comprise one or more first trace elements selected from Al, Ti, Y and Zn, one or more second trace elements selected from La, Ge, Sc and Sn, and one or more third trace elements selected from Ba, Eu, Mn and Zr. The gold alloy connecting wire prepared from the gold alloy is not prone to breakage in the drawing process, and wire bonding can be completed without protective gas when the gold alloy connecting wire is used.

Description

Technical field [0001] The present invention belongs to the field of semiconductor packaging technology, particularly, to a gold alloy and alloy products their preparation. Background technique [0002] Bonding wires is one of the key material of the semiconductor package, as a main chip and the external circuit connecting material of the signal transmission, plays the role of current conduction between the chip and external circuitry. Wire bonding is a key part of its packaging process. [0003] Gold wire bond leads corrosion resistance, high reliability, and are widely used in electronic packaging industry in high-end products. However, gold is expensive, in order to reduce packaging costs, have launched on the market various alternatives to the gold. Wherein the bonding material is a gold wire instead of copper has been applied, but because of its greater hardness, bonding is prone to chip damage, and the corrosion prone to non-hermetic package, bonded directly affect the devi...

Claims

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Application Information

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IPC IPC(8): C22C5/02C22C1/03C22F1/14C22C1/06B21C37/04
CPCC22C5/02C22C1/03C22F1/14C22C1/06B21C37/04
Inventor 刘洁闫茹张虎田柳
Owner 北京达博有色金属焊料有限责任公司