SMT technology for PCBA mainboard processing
A technology of surface mount and motherboard, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as lowering the qualification rate of circuit boards, and achieve the effect of improving effect and quality, reducing cost and reducing oxygen content.
Pending Publication Date: 2022-01-07
深圳市华思科泰电子有限公司
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Problems solved by technology
[0003] At present, in the process of SMT placement, due to various irregularities, the pass rate of circuit boards is reduced. Therefore, we propose the SMT surface mount process for PCBA motherboard processing.
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Embodiment
[0036] Such as figure 1 As shown, the SMT surface mount process for PCBA motherboard processing includes the following steps:
[0037] Step 1. Pretreatment: Clean and dry the PCBA main board; use ultrasonic cleaning equipment to ultrasonically clean the PCBA main board, and use a pre-oven to dry the cleaned PCBA main board, and the drying temperature is 80-100 °C, and the drying time is 7-100 °C. 8 hours;
[0038] Step 2. Printing solder paste: Put the solder paste into the solder pot for stirring, master the temperature of the solder in the solder pot, put a small amount of solder paste on the PCBA main board, and start the printing machine; the solder paste is made of eutectic tin-lead alloy, among which, The content of tin is 65%; the content of lead is 35%, and the temperature of the coated eutectic tin-lead alloy is 150-160°C;
[0039] Step 3, SMD placement: use an automated placement machine to pick up the SMT patch from the feeder and accurately mount it on the printe...
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The invention discloses an SMT for PCBA mainboard processing. The SMT comprises the following steps of: pretreatment, specifically, cleaning and drying a PCBA; solder paste printing; surface mount component mounting, specifically,picking up SMT components from a feeder by adopting an automatic surface mounting machine and accurately mounting the SMT components on a printed PCBA mainboard; reflow soldering, specifically, feeding the PCBA main board provided with the SMT components into a closed reflow soldering furnace, performing reflow soldering on the SMT components and the PCBA mainboard after the reflow soldering furnace is subjected to ventilation treatment, and circularly reducing pressure in the reflow soldering process; performance test, specifically, performing electrical test and function detection on a detected PCBA; aging test, specifically, simulating the daily use environment of the product through the comprehensive effects of high temperature, low temperature, high and low temperature change, electric power and the like on the PCBA, and exposing the defects of the PCBA; and packaging. According to the SMT for PCBA mainboard processing, the quantity of bubbles generated in the welding process is effectively reduced, the welding surface mounting quality and the qualified rate are improved, the property of a circuit board is detected in time, and the cost is reduced.
Description
technical field [0001] The invention relates to the technical field of PCBA mainboard processing, in particular to an SMT surface mount process for PCBA mainboard processing. Background technique [0002] Printed circuit board, also known as printed circuit board, printed circuit board, often uses the English abbreviation PCB, is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. It is made by technology, so it is called "printed" circuit board. SMT patch refers to the abbreviation of a series of process processes processed on the basis of PCBA. SMT is surface assembly technology, which is the most popular technology in the electronic assembly industry. And technology, electronic circuit surface assembly technology, called surface mount or surface mount technology, it is a method of mounting non-lead or short lead surface mount components on the surface of printed circuit boards or other su...
Claims
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Login to View More IPC IPC(8): H05K3/34
CPCH05K3/34
Inventor 周华谢勰
Owner 深圳市华思科泰电子有限公司