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Transceiving unit, transceiving assembly and phased-array antenna structure

A technology of transceiver unit and transceiver component, which is applied in the field of microwave communication and phased array radar, which can solve the problems of needing to be improved in integration, large volume and weight, and large longitudinal size of TR components, so as to save space and material cost, and improve radio frequency link Simple and easy to assemble effect

Active Publication Date: 2022-01-11
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the vertical size of the TR module is relatively large, and the aspect ratio of the top view of the 1×8-channel TR module is close to 1:1. The volume and weight of the array are relatively large, and the integration level needs to be improved.

Method used

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  • Transceiving unit, transceiving assembly and phased-array antenna structure
  • Transceiving unit, transceiving assembly and phased-array antenna structure
  • Transceiving unit, transceiving assembly and phased-array antenna structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiments of the present invention provide a transceiver unit, such as image 3 As shown, the transceiver unit includes a multi-layer digital microwave mixing board 201, a power splitting and combining network 208, a power supply module, a temperature detection module and a storage module, and the power splitting and combining network 208 is embedded in the Multi-layer digital microwave mixing board 201, the power division and combination network is the transmission link of signal power division and combination;

[0047] The power module includes two power control pads 210 and corresponding peripheral circuits, the temperature detection module is composed of a temperature sensor chip 212 and peripheral circuits, and the storage module is composed of a memory chip 211 and peripheral circuits;

[0048] combine Figure 4 As shown, the multi-layer digital microwave mixing board 201 forms a layered structure of L1-L19 layers through a microwave laminate dielectric layer 2...

Embodiment 2

[0070] Embodiment 2 of the present invention provides a transceiver component, such as figure 2 As shown, the transceiver assembly includes a cavity 3, a first transceiver unit 2, a second transceiver unit 4, and several radio frequency connectors 5 and rectangular connectors;

[0071]The cavity 3 includes positive and negative concave cavities in opposite directions, and the first transceiver unit 2 and the second transceiver unit 4 are respectively assembled into the concave cavities on the positive and negative sides of the cavity 3 with conductive silver glue or solder, Both the first transceiver unit and the second transceiver unit are provided with 1×8 radio frequency channels, wherein the first transceiver unit 2 includes two 1×8 radio frequency channels arranged back to back;

[0072] There are 18 radio frequency connectors 5, which are respectively arranged and connected to the common end and the antenna end of the radio frequency link of the transceiver unit, wherei...

Embodiment 3

[0076] Embodiment 3 of the present invention provides a highly integrated phased array antenna structure, such as figure 1 As shown, it includes: an array antenna layer stacked, a microchannel cold plate 102, a transceiver component layer, a drive feed network 104, a wave control motherboard 105, and a power motherboard 106. The transceiver component layer includes several transceiver components ;

[0077] Wherein, each of the transceiver components 103 (TR components) in the transceiver component layer is uniformly arranged in parallel, and the arrangement direction and the stacking direction are perpendicular to each other. In this embodiment, there are 8 transceiver components, and in the X direction Brick integration forms an array of TR components, and the transceiver component layer can be extended in the arrangement direction of the current transceiver components to add transceiver components, which can be extended and combined by setting the number of TR components in ...

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PUM

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Abstract

The invention provides a transmit-receive unit, a transmit-receive assembly and a phased-array antenna structure, and the transmit-receive assembly comprises a cavity, a first transmit-receive unit, a second transmit-receive unit, and a plurality of radio frequency connectors and rectangular connectors. The transceiving unit comprises a multi-layer digital microwave mixing board, a radio frequency amplification link, a radio frequency amplitude and phase modulation circuit, a power dividing and combining network, a power supply module, a wave control module, a temperature detection module and a storage module, and the multi-layer digital microwave mixing board is integrated with a TR-A chip, a vector modulator, a TR-B chip, a DAC-VM chip, a DAC-VG chip and an FPGA chip. The phased-array antenna comprises an array antenna layer, a micro-channel cold plate, a transceiving assembly layer, a driving feed network, a wave control mother board and a power supply mother board which are arranged in a stacked mode. The phased-array antenna is integrated in a brick-tile mixed mode, and the amplification factor and the turn-on or turn-off state of each TR radio frequency amplifier are timely and dynamically controlled in the transceiving unit through the FPGA and the DAC-VG.

Description

technical field [0001] The invention relates to the technical fields of microwave communication and phased array radar, in particular to a transceiver unit, a transceiver component and a phased array antenna structure. Background technique [0002] With the continuous development of phased array antenna technology, more stringent requirements are put forward on the performance, array flexibility, power consumption control, volume, weight and other aspects of the core component of phased array antenna - phased array TR components. . [0003] Conventional active phased array antenna TR component architecture can be roughly divided into two types: tile TR component and brick TR component. The tile-type TR module is small in size, light in weight, and highly integrated, but its disadvantages are complex stacked interconnection structure, high assembly difficulty, high integration requirements for all-in-one complex multi-functional TR chips, and limited heat dissipation perform...

Claims

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Application Information

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IPC IPC(8): H04B1/40H04B1/525H01Q21/00H01Q23/00
CPCH04B1/40H04B1/525H01Q21/00H01Q23/00
Inventor 阴明勇丁卓富邓金峰周沛翰薛伟冯琳
Owner 成都雷电微力科技股份有限公司