Tray for straw fiber bundle production logistics and preparation process thereof
A technology of straw fiber and preparation process is applied in the field of straw fiber bundle production logistics tray and its preparation process, which can solve the problems of affecting comfort and incapable of using devices, etc., so as to increase the comfort of use, reduce static electricity, and increase practicality. sexual effect
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Embodiment 1
[0032] Example 1: 1) Select high-quality materials, urethane acrylate: 8 parts; 1,6-hexanediol diacrylate: 30 parts; photoinitiator: 1 part; antistatic agent: 2 parts, compound extrusion, Mix PET, lubricant, antioxidant and toughening agent evenly, then put into twin-screw extruder for extrusion molding;
[0033] 2) Blister molding, through the blister molding equipment, at a temperature of 150 ° C, the extruded film material is hot-melted on the template, the film material is edge-bonded, vacuum blistered, cooled by cold air, and cut to obtain Bottom layer 1 of the electronic tray style;
[0034] 3) Stably connect the bottom layer to the support layer, and then wait for 2h to bond the elastic layer and the buffer layer respectively;
[0035] 4) Surface protection layer 5, use the applicator to scrape the matte ink on 2, put the PET substrate coated with the matte ink into the UV curing machine, and set up evenly distributed placement stripes on the cured surface. The produc...
Embodiment 2
[0038] Example 2: 1) Select high-quality materials, urethane acrylate: 9 parts; 1,6-hexanediol diacrylate: 35 parts; photoinitiator: 1 part; antistatic agent: 3 parts, mixed and extruded, Mix PET, lubricant, antioxidant and toughening agent evenly, then put into twin-screw extruder for extrusion molding;
[0039] 2) Blister molding, through the blister molding equipment, at a temperature of 170 ℃, the extruded film material is hot-melted on the template, the film material is edge-bonded, vacuum blistered, cooled by cold air, and cut to obtain Bottom layer 1 of the electronic tray style;
[0040] 3) Stably connect the bottom layer to the support layer, and then wait for 3h to bond the elastic layer and the buffer layer respectively;
[0041] 4) Surface protection layer 5, use the applicator to scrape the matte ink on 2, put the PET substrate coated with the matte ink into the UV curing machine, and set up evenly distributed placement stripes on the cured surface. The product ...
Embodiment 3
[0044] Example 3: 1) Select high-quality materials, urethane acrylate: 10 parts; 1,6-hexanediol diacrylate: 39 parts; photoinitiator: 2 parts; antistatic agent: 4 parts, mixed and extruded, Mix PET, lubricant, antioxidant and toughening agent evenly, then put into twin-screw extruder for extrusion molding;
[0045] 2) Blister molding, through the blister molding equipment, at a temperature of 200 ° C, the extruded film material is hot-melted on the template, the film material is edge-bonded, vacuum blistered, cooled by cold air, and cut to obtain Bottom layer 1 of the electronic tray style;
[0046] 3) Stably connect the bottom layer to the support layer, and then wait for 4h to bond the elastic layer and the buffer layer respectively;
[0047] 4) Surface protection layer 5, use the applicator to scrape the matte ink on 2, put the PET substrate coated with the matte ink into the UV curing machine, and set up evenly distributed placement stripes on the cured surface. The prod...
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