Resin composition for high frequency substrate and metal clad laminate

Abstract

A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 parts by weight, the resin composition for the high frequency substrate includes: 20 to 70 parts by weight of a polyphenylene ether resin, 5 to 40 parts by weight of a polybutadiene resin, 5 to 30 parts by weight of a bismaleimide resin, and 20 to 45 parts by weight of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230 DEG C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.

Description

technical field [0001] The invention relates to a resin composition for a high-frequency substrate and a metal laminate, in particular to a resin composition for a high-frequency substrate and a metal laminate that have good bonding force with a metal layer. Background technique [0002] Millimeter wave (mmWave) refers to electromagnetic waves with a wavelength of 1 mm to 10 mm and a frequency of 30 GHz to 300 GHz, also known as extremely high frequency (EHF). Millimeter wave is mainly used in electronic communication, military communication, scientific research and medical treatment, etc. It is also a key technology for the development of the fifth generation wireless system (5G). In order to meet the standards of 5G wireless communication, high-frequency transmission is undoubtedly the mainstream trend of current development. Accordingly, the industry is committed to the development of high-frequency substrate materials suitable for high-frequency transmission (for exampl...

AI Technical Summary

Problems solved by technology

However, the high-frequency substrate made of polyphenylene ether resin and polybutadiene resin has the problems of low glass transition temperature (Tg) and poor bonding between the high-frequency substrate and the metal layer.

Therefore, although the high-frequency substrate provided in the prior art may have expected dielectric properties, it is not conducive to processing

In addition, the use of polybutadiene tends to make the resin composition have a higher viscosity, which makes the prepreg made of the resin composition easy to stick to the hand, and is also unfavorable for processing.

[0005] According to the above, the prior art has not yet provided a resin composition for high-frequency substrates that is beneficial to processing, which can be used to produce high-frequency substrates with good dielectric properties and moderate glass transition temperature, and the high-frequency substrate and the metal layer can be separated. have good binding force

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