Preparation method of single-component room-temperature-curing high-temperature-resistant adhesive

A room-temperature-curing, high-temperature-resistant technology, applied in the direction of adhesives, polymer adhesive additives, adhesive types, etc., can solve the problems of insufficient temperature-resistant strength at 250°C and cumbersome construction process, etc., and achieve simple and easy production process, High retention rate, reasonable effect of preparation

Active Publication Date: 2022-01-28
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention aims to solve the problems of cumbersome construction process and insufficient temperature-resistant strength at 250°C of the existing room-temperature-curing high-temperature-resistant epoxy adhesive, and provides a preparation method of a single-component room-temperature-curable high-temperature-resistant adhesive

Method used

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  • Preparation method of single-component room-temperature-curing high-temperature-resistant adhesive
  • Preparation method of single-component room-temperature-curing high-temperature-resistant adhesive
  • Preparation method of single-component room-temperature-curing high-temperature-resistant adhesive

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specific Embodiment approach 1

[0018] Embodiment 1: This embodiment is a preparation method of a one-component room temperature curing high temperature resistant adhesive, which is carried out according to the following steps:

[0019] 1. Weigh 70 to 95 parts of tetraglycidylamine epoxy resin, 5 to 30 parts of AFG-90 epoxy resin and 10 to 50 parts of toughening agent by mass, and weigh 70 to 95 parts of four Glycidylamine type epoxy resin, 5 parts to 30 parts of AFG-90 epoxy resin and 10 parts to 50 parts of toughening agent are added to the reaction kettle, and the 2 Under the condition that the atmosphere and temperature are 145℃~155℃, stir for 1h~4h, and cool to room temperature to obtain product A;

[0020] 2. Weigh 10 to 50 parts by mass of maleic anhydride, 5 to 30 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 2 to 20 parts of 1, 4,5,8-Naphthalene tetracarboxylic anhydride, 10 to 50 parts of maleic anhydride, 5 to 30 parts of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 2 ...

specific Embodiment approach 2

[0030] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the toughening agent described in step 1 is one or both of carboxyl-terminated liquid nitrile rubber and epoxy-terminated liquid nitrile rubber. mixture. Others are the same as the first embodiment.

specific Embodiment approach 3

[0031]Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the tetraglycidylamine epoxy resin described in step 1 is AG-80 epoxy resin or MF-4101 epoxy resin. The tetraglycidylamine type epoxy resin described in one is AG-80 epoxy resin or MF-4101 epoxy resin. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a preparation method of a high-temperature-resistant adhesive, and in particular, relates to a preparation method of a single-component room-temperature-curing high-temperature-resistant adhesive. The invention aims to solve the problems of complicated construction process and insufficient 250 DEG C temperature-resistant strength of an existing room-temperature curing high-temperature-resistant epoxy adhesive. The method comprises the steps: 1, mixing tetraglycidyl amine type epoxy resin, AFG-90 epoxy resin and a flexibilizer at high temperature to obtain a product A; 2, grinding and mixing maleic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 1,4,5,8-naphthalene tetracarboxylic anhydride to obtain a product B; and 3, mixing the product A, the product B, a coupling agent and a curing accelerator.

Description

technical field [0001] The invention relates to a preparation method of a high temperature resistant adhesive. Background technique [0002] Epoxy resin is widely used in various fields such as electronic appliances, aerospace, ship transportation, and resin-based composite materials due to its excellent properties such as good adhesion and corrosion resistance. The commonly used epoxy resin curing systems mainly include epoxy / amine curing systems and epoxy / acid anhydride curing systems. Compared with polyamine curing agents, acid anhydride curing agents mainly have the following advantages: (1) In terms of operation technology: a. Low volatility, low toxicity, and low irritation to the skin; b. The compounding amount of epoxy resin Large, low viscosity after mixing with epoxy resin, more fillers can be added for modification, which is conducive to reducing costs; c. Long pot life, easy to operate; (2) Properties of the cured product: a. Due to the curing reaction Slower, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/42C09J11/08
CPCC09J163/00C09J11/08C08G59/4207C08G59/4223C08L2201/08C08L63/00C08L13/00C08L15/00Y02E60/10
Inventor 于国良孔宪志孙东洲吕虎李岳
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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