TO-CanLD assembly without backlight monitoring, and preparation method thereof

A backlight and component technology, applied in the laser field, can solve the problems of affecting the quality stability of laser products, affecting the use efficiency, and increasing the temperature drift coefficient, so as to increase the quality stability, avoid the falling off of the coating, and ensure the effect of cooling effect

Pending Publication Date: 2022-02-01
武汉斯优光电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] TO-CanLD packaged semiconductor lasers have the characteristics of small size, low energy consumption and long service life, and are widely used in optical fiber communication and optical fiber sensing. TO-CanLD packaged semiconductor lasers do not need refrigeration during theoretical use, but in actual use , often due to external factors or other restrictions, the temperature drift coefficient increases during use, resulting in reduced stability and affecting the actual use. The resistance to special overheating conditions is poor, and the existing TO-CanLD package semiconductor laser preparation The process is complicated. During the pin installation process, they are all connected by bonding gold wires, which increases the cost. At the same time, the PD chip is fixed by silver glue, which increases the risk of falling off and affects the quality and stability of laser products.

Method used

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  • TO-CanLD assembly without backlight monitoring, and preparation method thereof
  • TO-CanLD assembly without backlight monitoring, and preparation method thereof
  • TO-CanLD assembly without backlight monitoring, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] see Figure 1-4 , TO-CanLD component without backlight monitoring, including TO base 1, pin 2, pin positioning block 21, insulating sleeve 3, detection chip pad 4, backlight detector 5, bonding gold wire 6, heat sink 7, Heat dissipation layer 71, rear cover layer 72, water inlet cavity 73, guide cavity 74, water diversion cavity 75, first connection hole 76, second connection hole 77, transition cavity 78, drainage groove 79, third connection hole 710, Water outlet cavity 711, semiconductor laser 8, beam shaping system 9, lens optical system 10, semiconductor cooling chip 11, thermistor 12, TO tube cap 13.

[0036] The positions and connections of the above structures are as follows:

[0037]The inside of the TO base 1 is fixedly connected with the pin 2, the top of the TO base 1 is fixedly connected with the detection chip spacer 4, the top of the detection chip spacer 4 is fixedly connected with the backlight detector 5, the backlight detector 5 and the pin 2 is con...

Embodiment 2

[0049] A method for preparing a TO-CanLD component without backlight monitoring, comprising the following steps:

[0050] S1. Make the TO base 1, and open a connection hole for installing the pin 2 on the TO base 1. The inner diameter of the connection hole matches the insulation sleeve 3, and the insulation sleeve 3 and the connection hole are interference fit;

[0051] S2, making the heat sink 7, the heat dissipation layer 71 and the back cover layer 72 of the heat sink 7 are integrally processed and formed, and the material of the heat dissipation layer 71 and the back cover layer 72 is nickel-based alloy powder, which is formed by 3D printing;

[0052] S3, fuse the heat sink 7 made in S2 with the TO base 1, and adjust the heat sink 7 to be perpendicular to the top surface of the TO base 1;

[0053] S4, adopt LD chip as the chip of semiconductor laser 8, adopt PD chip as the chip of backlight detector 5, make pin 2 and its pin positioning block 21, make detection chip space...

Embodiment 3

[0060] A method for preparing a TO-CanLD component without backlight monitoring, comprising the following steps:

[0061] S1. Make the TO base 1, and open a connection hole for installing the pin 2 on the TO base 1. The inner diameter of the connection hole matches the insulation sleeve 3, and the insulation sleeve 3 and the connection hole are interference fit;

[0062] S2, making the heat sink 7, the heat dissipation layer 71 and the rear cover layer 72 of the heat sink 7 are integrally processed and formed, and the materials of the heat dissipation layer 71 and the rear cover layer 72 are tungsten-copper alloy powder, which are formed by 3D printing;

[0063] S3, fuse the heat sink 7 made in S2 with the TO base 1, and adjust the heat sink 7 to be perpendicular to the top surface of the TO base 1;

[0064] S4, adopt LD chip as the chip of semiconductor laser 8, adopt PD chip as the chip of backlight detector 5, make pin 2 and its pin positioning block 21, make detection chip...

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PUM

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Abstract

The invention relates to the technical field of laser, and discloses a TO-CanLD assembly without backlight monitoring. The assembly comprises a TO pedestal, the interior of the TO pedestal is fixedly connected with a pin, the top of the TO pedestal is fixedly connected with a detection chip cushion block, the top of the detection chip cushion block is fixedly connected with a backlight detector, and a gold bonding wire is connected between the backlight detector and the pin. The outer surface of the heat sink is cooled through the water distribution cavity, the hole diameter of a second connecting hole is smaller than that of a first connecting hole, so that the flow speed of water flow in the water distribution cavity is limited, and the cooling effect is guaranteed; and the stability of the water flow is guaranteed by forming the third connecting hole in the top of the drainage groove and the top of the transition cavity. And meanwhile, a guide cavity is located in a semiconductor chilling plate area, the semiconductor chilling plate further guarantees the temperature of refrigeration water, the cooling effect is effectively guaranteed, the working stability of the device in the high-temperature environment is guaranteed, and the resistance to the temperature environment is improved.

Description

technical field [0001] The invention relates to the field of laser technology, in particular to a TO-CanLD component without backlight monitoring and a preparation method thereof. Background technique [0002] TO-CanLD packaged semiconductor lasers have the characteristics of small size, low energy consumption and long service life, and are widely used in optical fiber communication and optical fiber sensing. TO-CanLD packaged semiconductor lasers do not need refrigeration during theoretical use, but in actual use , often due to external factors or other restrictions, the temperature drift coefficient increases during use, resulting in reduced stability and affecting the actual use. The resistance to special overheating conditions is poor, and the existing TO-CanLD package semiconductor laser preparation The process is complicated. During the pin installation process, they are all connected by bonding gold wires, which increases the cost. At the same time, the PD chip is fix...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/02212H01S5/02253H01S5/0232H01S5/02326H01S5/02345H01S5/024
CPCH01S5/02212H01S5/0232H01S5/02345H01S5/02469H01S5/02423H01S5/02253H01S5/02326H01S5/02415
Inventor 钱义龙张萌陈研
Owner 武汉斯优光电技术有限公司
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