Laser processing device, processing equipment and processing method

A laser processing and laser technology, which is applied in the direction of laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problem that the cutting production capacity of solar cells needs to be further improved, and achieve the goal of saving cutting time, increasing cutting production capacity and saving work stations Effect

Pending Publication Date: 2022-02-11
WUHAN DR LASER TECH CORP LTD
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Problems solved by technology

However, the cutting capacity of the existing solar cells needs to be further improved

Method used

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  • Laser processing device, processing equipment and processing method
  • Laser processing device, processing equipment and processing method
  • Laser processing device, processing equipment and processing method

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Embodiment Construction

[0095] As in the background art, the cutting capacity of existing solar cells needs to be further improved. The inventors found that, if figure 1 As shown, in the prior art, the first laser is used at the first station to form the cutting groove 11 at the beginning and the end of the path to be cut of the solar cell sheet 10, and then as shown in FIG. figure 2 As shown in the second station, the second laser (thermal stress laser) is used to scan along the path to be cut to form the cutting line 12, so that the solar cell sheet 10 is split (that is, the second laser scans along the path to be cut to provide heat) Gradient, the device to be cut produces microcracks along the cutting groove 11 and extends to make the device to be cut crack along the path to be cut, that is, the cutting line 12), and the reason for the low production capacity is mainly that the first laser and the second laser The two stations alternately cut the solar cells 10 , making the cutting process long...

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Abstract

The invention provides a laser processing device, processing equipment and processing method. The laser processing device comprises a laser adjusting module used for dividing a first laser beam into a plurality of first sub-laser beams and dividing a second laser beam into a plurality of second sub-laser beams, the first sub-laser beams form a plurality of first light spots, and the second sub-laser beams form a plurality of second light spots; any first light spot is located at a preset distance in front of one second light spot; the device also includes a first movement module used for driving a first laser device, a second laser device and the laser adjusting module to move, or driving a to-be-cut device to move, so that the plurality of first sub-laser beams move along the plurality of preset cutting paths, and the plurality of second sub-laser beams also move along the plurality of preset cutting paths; and any first sub-laser beam and any second sub-laser beam sequentially form a cutting groove and a cutting line on a preset cutting path, so that the cutting time is saved, the cutting production process is shortened, and the cutting productivity is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, and more specifically, to a laser processing device, processing equipment and a processing method. Background technique [0002] With the development of laser non-destructive cutting technology, it has also been applied in the field of solar cell technology. That is, the laser is first used to scan the solar cells along the path to be cut to form one or more cutting grooves, and then another laser is used to scan along the path to be cut to form thermal stress, so that the solar cells are split along the path to be cut to realize solar energy. Cell cutting. However, the cutting capacity of the existing solar cells needs to be further improved. Contents of the invention [0003] In view of this, the present invention provides a laser processing device, processing equipment and processing method to improve the productivity of laser cutting. [0004] To achieve the above object, the pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/067B23K26/70H01L31/18
CPCB23K26/38B23K26/402B23K26/067B23K26/70H01L31/18B23K26/0673Y02P70/50
Inventor 梁乔春李志刚朱凡朱胜鹏
Owner WUHAN DR LASER TECH CORP LTD
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