Etching device

Abstract

The invention provides an etching device. The etching device comprises a base, a containing part, a rotating disc, a translation part and a jet part; a fixing base is arranged on the base and provided with a containing cavity and a top cover, and a through hole is formed in the top cover; the rotating disc is arranged in the containing cavity and connected with a rotating driving assembly; the translation part is slidably arranged on the containing part and provided with a reaction cavity and an air inlet hole; and the jet part is arranged on the translation part and provided with a liquid inlet channel. During use, etching liquid is input into the reaction cavity through the liquid inlet channel, the internal pressure of the reaction cavity is reduced, external gas enters the reaction cavity through the gas inlet hole and reacts with the etching liquid, and a product with etching capability is formed. The translation part is moved until the reaction cavity is communicated with the through hole, so that the product flows into the containing cavity; and meanwhile, the rotating driving assembly is started, and the rotating disc drives a to-be-etched object to rotate. According to the etching device provided by the embodiment of the invention, a product can be prevented from reacting with the external environment, the etching efficiency can be improved by the structure of the etching device, and the etching effect is also ensured.

Description

Technical field [0001] The present invention belongs to the field of environmental etching techniques, and more particularly to an etching device. Background technique [0002] Etching refers to the process of removing excess materials of the object by erosion, corrosion, and the like. When the work is etched, it is necessary to apply to a large amount of oxidative substance. In the prior art, there is usually a regenerative reduction reaction using sodium chlorate or hydrogen peroxide, and a divalent chloride having oxidity is etched. [0003] During the long-term production process, the inventors found that when the above reaction, a large amount of oxidant and hydrogen peroxide needed to increase the reaction cost and wastewater treatment cost; in order to control cost, inventors redesigned and select the relevant reaction equation, it is proposed Energy-saving and emission reduction work mode for responding to etching liquid (2bar-3bar) and oxygen. [0004] Specifically, the ...

AI Technical Summary

Problems solved by technology

[0007] An embodiment of the present invention provides an etching device, which aims to solve the technical problem that when a product with etching ability is formed through the reaction of oxygen and etching solution, due to the large amount of water inside the product, the etching effect of the product is deteriorated.

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