Tray transfer method for microelectronic packaging assembly between high-vacuum sealed cavities

A technology of microelectronic packaging and closed cavity, which is applied in transportation and packaging, conveyors, mechanical conveyors, etc., to overcome high cost, simple driving structure, and reduce space size.

Active Publication Date: 2022-02-22
西北电子装备技术研究所
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] The invention provides a pallet transfer method for microelectronic packaging components between high-vacuum airtight chambers, and solves the technical problem of how to use a simple and economical drive mechanism to complete pallet transfer in a limited space

Method used

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  • Tray transfer method for microelectronic packaging assembly between high-vacuum sealed cavities
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  • Tray transfer method for microelectronic packaging assembly between high-vacuum sealed cavities

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Embodiment Construction

[0027] The present invention is described in detail below in conjunction with accompanying drawing:

[0028] A microelectronic packaging assembly tray transfer mechanism between high-vacuum airtight chambers, including a box-shaped frame base 101, a worktable 107 is arranged on the top of the box-shaped frame base 101, and the worktable 107 is adjacent to and independent of each other A baking airtight cavity 102 and an activation airtight cavity 103 are arranged respectively. Between the baking airtight cavity 102 and the activation airtight cavity 103, a communication gate valve 104 connecting the two chambers is arranged. 102 is provided with a loading door 105 on the left side facade, and is provided with a second door valve 106 on the right side facade of the activated airtight cavity 103, and is respectively provided with a transfer screw support frame 149 and Lead screw drive motor reducer 144, between transmission drive lead screw support frame 149 and lead screw drive...

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Abstract

The invention discloses a tray transfer method for a microelectronic packaging assembly between high-vacuum closed cavities. The problem of how to complete tray transfer in a limited space by adopting a simple and economical driving mechanism is solved. A gate valve is arranged between two high vacuum chambers for microelectronic packaging assembly tray transfer, a transfer mechanism is arranged in a second activated process chamber, and a driving motor of the transfer mechanism is arranged outside the process chamber, so that the independent sealing performance of the process chamber is ensured, and meanwhile, the stable and reliable movement of the tray is realized due to good guidance; compared with a vacuum motor, the driving motor reducer adopts a common motor, so that the cost is reduced and the service life is prolonged; besides, the length of a mechanical arm is shortened, the intermittent segmented conveying of the trays is achieved through reciprocating work of the mechanical arm, and the purpose of reducing the occupied space of the tray transferring mechanism is achieved; the process cavity is independent, the transfer of the high-vacuum trays is achieved, and the driving structure is simple, economical, reliable and durable.

Description

technical field [0001] The invention relates to a microelectronic packaging device, in particular to a transfer mechanism and a transfer method for completing trays of microelectronic packaging components between high-vacuum multi-chambers. Background technique [0002] Microelectronic packaging and assembly (MEMS devices), that is, using film technology and micro-processing technology to arrange, paste, fix and connect chips and other elements on the frame or substrate, lead out the connection terminals, and potting and fixing them through plastic insulating media. Then, according to the electrical schematic diagram or logic diagram, microelectronics technology and high-density assembly technology are used to assemble microelectronic devices and micro-miniature components into applicable and producible electronic components, components or a technical process of a system; currently, vacuum packaging equipment It is changing from a single machine to a multi-chamber capable of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G35/00
CPCB65G35/00Y02P70/50
Inventor 杨晓东王成君王玉亮王涛李少飞薛志平
Owner 西北电子装备技术研究所
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