Tray transfer method for microelectronic packaging assembly between high-vacuum sealed cavities
A technology of microelectronic packaging and closed cavity, which is applied in transportation and packaging, conveyors, mechanical conveyors, etc., to overcome high cost, simple driving structure, and reduce space size.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] The present invention is described in detail below in conjunction with accompanying drawing:
[0028] A microelectronic packaging assembly tray transfer mechanism between high-vacuum airtight chambers, including a box-shaped frame base 101, a worktable 107 is arranged on the top of the box-shaped frame base 101, and the worktable 107 is adjacent to and independent of each other A baking airtight cavity 102 and an activation airtight cavity 103 are arranged respectively. Between the baking airtight cavity 102 and the activation airtight cavity 103, a communication gate valve 104 connecting the two chambers is arranged. 102 is provided with a loading door 105 on the left side facade, and is provided with a second door valve 106 on the right side facade of the activated airtight cavity 103, and is respectively provided with a transfer screw support frame 149 and Lead screw drive motor reducer 144, between transmission drive lead screw support frame 149 and lead screw drive...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com