Microwave digital mixing assembly based on metal-based composite substrate

Abstract

The invention discloses a microwave digital hybrid assembly based on a metal-based composite substrate, which comprises a box body and the metal-based composite substrate arranged in the box body, the metal-based composite substrate comprises a layer of metal matrix, and the box body comprises a packaging shell, a radio frequency connector and a low-frequency electrical connector. The metal-based front plate is a high-frequency core plate and is provided with a first step and a second step which are used for arranging a circuit, and the metal-based back plate is a low-frequency core plate and is provided with a third step which is used for arranging a circuit; the hybrid assembly further comprises a microwave part composed of a plurality of bare tube cores arranged in the first step and the second step, a digital part arranged on the high-frequency core board and a power supply low-frequency part arranged on the low-frequency core board. According to the invention, the assembly requirement of the microwave bare tube core is met, a digital packaging device can be integrated, and microwave digital hybrid integration is realized.

Description

technical field [0001] The invention belongs to the technical field of microwave devices, in particular to a microwave digital hybrid component based on a metal matrix composite substrate. Background technique [0002] The Chinese invention patent with publication number CN105407628 B discloses a microwave digital device and a processing method thereof. In the method, the composite circuit board laminated multiple times is filled with glue and then laminated with the metal shell, and the metal shell is located on the surface of the composite board and is completely exposed. [0003] The Chinese utility model patent whose publication number is CN202503804 U discloses a kind of single-sided double-layer circuit board. The single-sided double-layer circuit board includes a circuit board with printed circuits on both sides, and a metal plate that is pressed and bonded to one side of the circuit board through an insulating layer. In this technical solution, the metal base plate...

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Problems solved by technology

[0004] The above-mentioned technical solution is characterized in that the metal substrate is located on the outer surface of the laminated multilayer printed circuit, which is used to improve the structural strength and thermal conductivity of the circuit, but does not provide an effective reference ground plane for the transmission of high-frequency signals. Cannot support high frequency signal transmission

[0005] The Chinese invention patent with the publication number CN 101460018A discloses a printed circuit board and its manufacturing method, and a radio frequency device. The first layer of the printed circuit board in this technical solution is a microwave plate, the second layer is an ordinary plate, and the middle Prepreg, the printed circuit board is provided with back-drilled holes or back-drilled slots in the via holes, the front and back sides can be soldered with surface-mounted devices, but bare-die devices cannot be assembled, and the printed circuit board is embedded with heat-dissipating metal blocks, but it has not been realized The whole board high frequency board and the method of embedding the whole board copper substrate

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