Preparation method of net pressing copper nanometer packed bed heat dissipation material

Abstract

The invention relates to a preparation method of a net pressing copper nanometer accumulation bed heat dissipation material. The preparation method comprises the following steps: respectively carrying out ball milling and mixing on four sodium chloride particles with different particle sizes and nanometer copper powder to obtain four mixed particles; paving the four mixed particles into a tabletting mold according to the size of the sodium chloride particles, and finally placing a copper net on the uppermost layer; carrying out compression molding on the mixed particles by adopting a cold pressing method, and maintaining the pressure for 3-5 minutes after the compression is completed, so as to obtain a net-pressing copper nano stacking bed; putting the net pressing copper nano stacking bed into a tubular furnace for vacuum sintering at the temperature of 650-750 DEG C for 1.5-2 hours; and finally, washing until no sodium chloride particles are separated out to obtain the high-porosity net pressing copper nano accumulation bed heat dissipation material. According to the method, the production process can be simplified, and the difficulty of the preparation process and the requirement for instrument precision are reduced; the prepared heat dissipation material can be applied to phase-change heat transfer, has excellent phase-change heat transfer performance, and can greatly improve the cooling efficiency of electronic devices.

Description

technical field [0001] The invention belongs to the technical field of inorganic metal materials, and in particular relates to a method for preparing a heat dissipation material made of copper, in particular to a method for preparing a heat dissipation material of a pressed mesh copper nano-stacked bed. Background technique [0002] With the increasing popularity of electronic products and the high density of electronic devices, the heat generated by electronic devices also increases. Inefficient heat dissipation will greatly reduce the operating efficiency and lifespan of electronic devices. Therefore, it is imperative to effectively optimize the structure of the heat sink. [0003] The current common electronic devices generally use copper metal materials for heat dissipation, and some heat dissipation devices use a fin structure to optimize heat dissipation. However, this heat dissipation optimization method occupies more space of the electronic device, increases the siz...

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Problems solved by technology

Although this method has good heat resistance and good heat conduction effect at high temperature, when it is in a liquid working fluid, the boiling heat transfer effect that can be achieved in the face of phase change heat transfer is still unknown.

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