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Wafer scribing machine for computer mainboard processing

A computer motherboard and dicing machine technology, which is applied to the parts of grinding machine tools, abrasive surface adjustment devices, manufacturing tools, etc., can solve problems such as the resistance imposed by the grinding wheel, and achieve the effects of accelerating cooling, increasing wear and improving cooling efficiency.

Pending Publication Date: 2022-03-04
DEZHOU VOCATIONAL & TECHN COLLEGE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the deficiencies in the use of the existing wafer dicing machine proposed in the background technology, the present invention provides a wafer dicing machine for computer motherboard processing The machine has the advantage of avoiding the resistance of the water jet device to the grinding wheel, thus affecting the cutting effect of the grinding wheel on the wafer, and solves the technical problems raised in the above-mentioned background technology

Method used

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  • Wafer scribing machine for computer mainboard processing
  • Wafer scribing machine for computer mainboard processing
  • Wafer scribing machine for computer mainboard processing

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] see figure 1 , a wafer dicing machine for computer motherboard processing, comprising a grinding wheel 1, water chambers 2 are fixedly installed on both sides of the grinding wheel 1, and the inside of the grinding wheel 1 is located inside the water chamber 2. A flow hole 3 is opened inside the water chamber 3, and the flow hole 3 It runs through the grinding wheel 1 horizontally, and the flow hole 3 communicates with the water chamber 2 on both sides ...

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Abstract

The invention relates to the technical field of computer component machining, and discloses a wafer scribing machine for computer mainboard processing, which comprises a grinding wheel, water cavities are fixedly mounted on two sides of the grinding wheel respectively, a circulation hole is formed in the grinding wheel, the circulation hole horizontally penetrates through the grinding wheel, and the water cavities on two sides of the grinding wheel are communicated with each other through the circulation hole. A jet hole is formed in the water cavity and communicates with the water cavity. Through the arrangement of the jet flow holes, water sprayed out of the jet flow holes makes full and continuous contact with the wheel edge of the grinding wheel, and then the situation that water flow sprayed out of an original device only makes contact with a certain area of the wheel edge of the grinding wheel for cooling, and consequently the cooling effect is reduced is avoided; and the jet flow holes are closer to the grinding wheel blade, so that water flow sprayed out of the jet flow holes can reach the contact position of the wheel blade and the wafer more quickly, cooling of the grinding wheel is accelerated, and the cooling efficiency of the grinding wheel is improved.

Description

technical field [0001] The invention relates to the technical field of computer component processing, in particular to a wafer dicing machine for computer motherboard processing. Background technique [0002] The computer motherboard is also called the system board. It is one of the most basic and important components of the computer. The chipset is the core of the motherboard. The existing chip is made by dividing the wafer into a certain number of parts through a wafer dicing machine. After that, the circuit is printed on the silicon wafer through other equipment, and finally the chip is obtained. [0003] Some existing wafer dicing machines cut wafers through high-speed rotating grinding wheels when they are working. When it is round, the water injection devices on the front and rear sides spray the grinding wheel axially, and the water injection device in the direction of the grinding wheel sprays water radially on the grinding wheel, thereby cooling the grinding wheel....

Claims

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Application Information

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IPC IPC(8): B24B27/06B24B41/04B24B53/007B24B55/02H01L21/78
CPCB24B27/0683B24B41/04B24B55/02B24B53/007H01L21/78
Inventor 牟思
Owner DEZHOU VOCATIONAL & TECHN COLLEGE
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