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Electronic packaging structure, manufacturing method of electronic packaging structure and electronic equipment

An electronic packaging and manufacturing method technology, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of long time and cumbersome steps, reduce manufacturing time and manufacturing costs, simplify manufacturing processes, and realize multi-layer lead distribution. Effect

Pending Publication Date: 2022-03-04
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition to the cumbersome steps, the multi-channel process is also time-consuming

Method used

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  • Electronic packaging structure, manufacturing method of electronic packaging structure and electronic equipment
  • Electronic packaging structure, manufacturing method of electronic packaging structure and electronic equipment
  • Electronic packaging structure, manufacturing method of electronic packaging structure and electronic equipment

Examples

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Embodiment Construction

[0038] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise.

[0039] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way serves as any limitation of the application, its application or uses.

[0040] Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

[0041] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have diffe...

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PUM

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Abstract

The embodiment of the invention provides an electronic packaging structure, a manufacturing method of the electronic packaging structure and electronic equipment. The electronic packaging structure comprises a substrate, a functional chip, a packaging layer and a rewiring layer, the functional chip is arranged on the substrate and is electrically connected with the substrate; the packaging layer is formed on the substrate and covers the functional chip, and a wiring groove is formed in the packaging layer; the rewiring layer comprises a covering layer and a first electric connecting part, the substrate and / or the functional chip are / is electrically connected with the first electric connecting part through lead bonding in the wiring groove, the covering layer is filled in the wiring groove, and the first electric connecting part is exposed out of the surface of the covering layer. According to the embodiment of the invention, a scheme capable of being electrically connected with an external circuit is provided for the electronic packaging structure, the electric connection part is directly led out to the outer surface of the packaging structure by adopting a lead bonding process, and the electronic packaging structure has the characteristic of simple process.

Description

technical field [0001] The embodiments of the present application relate to the technical field of chip packaging, and more specifically, the present application relates to an electronic packaging structure, a method for manufacturing the electronic packaging structure, and electronic equipment. Background technique [0002] With the rapid development of electronic technology, various electronic products emerge in an endless stream, the functions of electronic products are increasing, and the requirements for chip size are also getting higher and higher. The packaging process of some high-performance chips usually involves the use of rewiring technology to form a redistribution layer (redistribution layer, RDL), so as to adjust the output and input positions of components. [0003] SIP packaging (System In a Package) is to integrate multiple functional chips, such as processors, memory and other functional chips, into one package, so as to realize a basically complete functi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L23/488H01L23/31H01L21/50H01L21/56H01L21/60
CPCH01L23/49H01L23/3121H01L23/488H01L21/50H01L21/56H01L24/85H01L2224/85
Inventor 張錫光刘家政刘文科
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD