DMF (Dimethyl Formamide) dielectric layer film covering method and system and digital micro-fluidic chip

Abstract

The invention relates to a DMF (Dimethyl Formamide) dielectric layer film covering method and system and a digital micro-fluidic chip, the DMF dielectric layer film covering method comprises the following steps: placing a substrate of the digital micro-fluidic chip on a vacuumizing plate; covering the substrate with a dielectric layer film to obtain a substrate with a dielectric layer; the substrate with the dielectric layer is vacuumized through a vacuumizing plate, and the substrate with the dielectric layer coated with a film is obtained; and coating a hydrophobic layer on the dielectric layer of the substrate coated with the dielectric layer to obtain the substrate coated with the hydrophobic layer. The utilization rate of the substrate and the metal electrode can be improved.

Description

technical field [0001] The invention relates to the technical field of digital microfluidics, in particular to a DMF dielectric layer coating method, system and digital microfluidics chip. Background technique [0002] Digital microfluidics (DMF), also known as lab on a chip (Lab on a Chip), is a fluid control technology that operates on micro-droplets. Digital microfluidic technology can control the movement of multiple droplets at the same time. By programming the movement paths of different droplets, operations such as movement and mixing of droplets can be realized, and operations in the laboratory can be integrated into a digital microfluidic On the control chip, it can quickly generate reaction droplets, and can ensure that each reaction system does not interfere with each other, improving the speed and efficiency of biological and chemical sample preparation, reaction, separation, detection and other analysis processes. Compared with traditional laboratories, digital...

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Problems solved by technology

However, the dielectric film obtained by these two methods is too closely attached to the substrate and metal electrodes, and the substrate and metal electrodes are likely to be damaged during the process of removing the dielectric film, which is not conducive to the reuse of substrates and metal electrodes. , while for microfluidic chips, the processing of substrates and metal electrodes often requires a large cost

Moreover, for the spin coating method, there are certain requirements on the size of the microfluidic chip. If the chip is too large, or the area to be coated is too large, the coating effect will be affected.

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