Polyurethane modified epoxy resin adhesive material as well as preparation method and application thereof

An epoxy resin and polyurethane modification technology, applied in the field of adhesive materials, can solve the problems of poor toughness, easy dripping, bonding and filling and sealing at unfavorable gaps

Active Publication Date: 2022-03-11
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin also has its own shortcomings, mainly poor toughness, strong fluidity during heat curing, and easy to drip, which is not conducive to bonding and filling and sealing gaps.

Method used

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  • Polyurethane modified epoxy resin adhesive material as well as preparation method and application thereof
  • Polyurethane modified epoxy resin adhesive material as well as preparation method and application thereof
  • Polyurethane modified epoxy resin adhesive material as well as preparation method and application thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0051] The present invention provides the preparation method of above-mentioned polyurethane modified epoxy resin adhesive material, comprises the following steps:

[0052] (1) mixing polytetrahydrofuran diol and toluene-2,4-diisocyanate for prepolymerization to obtain a polyurethane prepolymer;

[0053] (2) heating and mixing the polyurethane prepolymer, epoxy resin, nano-alumina, graphene, 3,3'-dichloro-4,4'-diaminodiphenylmethane and thickener, A polyurethane-modified epoxy resin adhesive material was obtained.

[0054] The invention mixes polytetrahydrofuran diol and toluene-2,4-diisocyanate for prepolymerization to obtain polyurethane prepolymer. In the present invention, the mixing is preferably stirring mixing, and the stirring speed is preferably 500-800 rpm, more preferably 600-700 rpm. In the present invention, the temperature of the pre-polymerization is preferably 55-65° C., more preferably 60° C., and the time is preferably 55-65 minutes, more preferably 60 minu...

Embodiment 1

[0074] The types and amounts of raw materials used in Example 1 are shown in Table 2.

[0075] The preparation method of polyurethane modified epoxy resin adhesive material is as follows:

[0076] (1) Put polytetrahydrofuran diol and toluene-2,4-diisocyanate into a flask, mechanically stir at a rate of 600 rpm in an oil bath at 60°C for 60 minutes, and react to obtain a polyurethane prepolymer;

[0077] (2) Add epoxy resin, nano-aluminum oxide, graphene, thickener, 3,3'-dichloro-4,4'-diaminodiphenylmethane into the polyurethane prepolymer, and heat up to 80 °C, mechanically stirred at a rate of 2000 rpm for 5 minutes, mixed evenly, and degassed in a vacuum oven;

[0078] (3) Put the obtained mixture in an oven at 120°C for 3 hours, and then add it to coat with a film coater, control the temperature of the film coater to 85°C, control the film thickness to 0.5±0.1mm, the width is about 10±1cm, and the length is 20 ±1cm, the temperature was lowered to room temperature, and the...

Embodiment 2

[0093] The types and amounts of raw materials in Example 2 are shown in Table 2. The preparation method is the same as in Example 1. The technical parameters of the cured polyurethane-modified epoxy resin adhesive material are shown in Table 4.

[0094] The technical parameters of the polyurethane-modified epoxy resin adhesive material after table 4 embodiment 2 curing

[0095]

[0096]

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Abstract

The invention provides a polyurethane modified epoxy resin adhesive material as well as a preparation method and application thereof, and belongs to the technical field of adhesive materials. According to the invention, polyurethane is used for toughening modification of epoxy resin, polytetrahydrofuran diol and toluene-2, 4-diisocyanate are used as raw materials for synthesis of a polyurethane prepolymer, and isocyanate groups in the polyurethane prepolymer can react with hydroxyl groups in the epoxy resin, so that the epoxy resin is subjected to a reaction with hydroxyl groups in the epoxy resin; when the epoxy resin is subjected to toughening modification, no great negative influence is generated on the strength, and the polyurethane has high polarity and high bonding strength on a cable heat shrink tube. The 3, 3 '-dichloro-4, 4'-diaminodiphenyl methane is used as the curing agent, the fluidity of the adhesive material is adjusted by using the nano aluminum oxide, the graphene and the thickening agent, and the obtained adhesive material is in an elastomer form, and can be changed into a flowable liquid state to fill a sealing gap without dripping during thermocuring; therefore, effective bonding and sealing of gaps are realized.

Description

technical field [0001] The invention relates to the technical field of adhesive materials, in particular to a polyurethane-modified epoxy resin adhesive material and its preparation method and application. Background technique [0002] The cable heat shrink tube is an important line of defense to protect the cable joints and the internal cables at the connection. Airplanes, automobiles, and large electrical appliances require many connecting wires, plugs, splitters, etc., and heat shrinkable tubes must be used to protect the corresponding parts. However, there are gaps between the heat-shrinkable tube and the cable branch, and the connection of the cable plug. Water, oil, etc. are easy to enter, resulting in serious consequences such as leakage and short circuit, which will affect the use of the equipment. Adhesives need to be used for filling and bonding , Play the role of sealing protection. [0003] Epoxy resin adhesives are often used as heat shrinkable tubes and cable...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J175/08C09J11/04
CPCC09J163/00C09J11/04C08K2003/2227C08K2201/005C08K2201/006C08K2201/011C08L2203/206C08L2201/08C08L75/08C08K3/22C08K3/042
Inventor 陈守兵王进踞浩张耀明张昌盛杨增辉王廷梅王齐华江一卉刘建峰
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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