Device for processing silicon wafer in electronic device

Abstract

The invention provides a device for processing a silicon wafer in an electronic instrument, and belongs to the technical field of electronic element processing, the device comprises a fixing plate, and a connecting seat is mounted at the lower end of the fixing plate; the cutting piece is mounted on the fixing plate; the feeding piece is mounted on the fixing plate; the conveying part is mounted at the lower end of the bracket; and the tidying mechanism is mounted on the ground. According to the device, a semiconductor crystal bar is pushed to the left side through a hydraulic rod on a sliding plate, continuous feeding is achieved, and the cutting thickness can be adjusted by adjusting the positions of two sets of nuts on a disc bolt; the silicon wafers slide down in the groove between the first sorting plate and the second sorting plate, so that the silicon wafers are arranged, the silicon wafers are prevented from being discharged disorderly, the height of the height limiting plate and the angle of the width limiting strip are adjusted, the diameters and the thicknesses of the silicon wafers can be inspected, the silicon wafers with the thicknesses and the diameters exceeding the standard are blocked, and the silicon wafers are prevented from being damaged. Therefore, the thickness and the diameter of the silicon wafer can be detected.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a silicon wafer processing device inside an electronic device. Background technique [0002] A semiconductor refers to a material whose conductivity can be controlled, and its conductivity is between that of a conductor and an insulator at room temperature. No matter from the perspective of technology or economic development, the importance of semiconductors is huge. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one among various semiconductor materials; the existing semiconductor wafer cutting equipment is limited in structure or design. The degree of automation is low, manual feeding is required, and the output of the cut silicon wafers is messy, and the thickness and diameter of the cut silicon wafers cannot be inspected. Contents of the invention [0003] In view of this, the present...

AI Technical Summary

Problems solved by technology

Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one among various semiconductor materials; the existing semiconductor wafer cutting equipment is limited in structure or design. The degree of automation is low, manual feeding is required, and the output of the cut silicon wafers is messy, and the thickness and diameter of the cut silicon wafers cannot be inspected

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