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Connector bonding pad and anti-bonding pad on PCB

A PCB board and connector technology, which is applied in the direction of electrical connection of printed components, printed circuits connected with non-printed electrical components, printed circuit components, etc., can solve the difficulty of high-density board design and miniaturization of PCB design Unfavorable, microstrip line width and other issues, to increase the number of inner layer traces, is conducive to miniaturization design, and reduce the effect of impedance mutation

Active Publication Date: 2022-03-15
INSPUR (SHANDONG) COMPUTER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the impedance adjustment in the signal transmission process, increasing the dielectric thickness of the microstrip line results in a wider width of the microstrip line, and for a specific stack impedance, the designed microstrip line width after simulation is certain, changing the local microstrip line The line width also produces impedance discontinuity, and increasing the width is very difficult for the design of high-density boards; and the method of hollowing out a large area of ​​​​the ground plane under the connector must refer to the third layer, which is easy Causes the problem of cross-segmentation, and also has an adverse effect on the miniaturization of PCB design

Method used

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  • Connector bonding pad and anti-bonding pad on PCB
  • Connector bonding pad and anti-bonding pad on PCB
  • Connector bonding pad and anti-bonding pad on PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 2 As shown, the first embodiment provides a connector pad on a PCB, including a first vertex 101, a second vertex, a third vertex, a fourth vertex, and a fifth vertex, wherein the first vertex 101 and the second vertex are located at On the upper side, the fourth apex is located on the lower side, and the third and fourth apexes are located in the middle.

[0040] The first vertex 101 and the second vertex are located on the same horizontal line, and the first vertex 101 is located on the right side of the second vertex, and the connecting line between the first vertex 101 and the second vertex constitutes the short side of the pad.

[0041] In this embodiment, the horizontal distance between the first vertex 101 and the second vertex is 6 to 6.5 mils, and the length of the short side of the pad is as close as possible to the width of the high-speed line, which greatly reduces the noise generated when the high-speed signal passes through the connector. ...

Embodiment 2

[0053] In the process of PCB routing design, when performing high-speed signal fan-out, the high-speed signal pins of the connector need to design anti-pads on the second layer. On the basis of Embodiment 1, this embodiment provides an anti-pad of a connector on a PCB. The shape of the upper part of the anti-pad is consistent with the design of the pad, and the lower part is cut.

[0054] Such as Image 6 As shown, the anti-pad of the connector on the PCB provided by the second embodiment includes the sixth vertex at the point of the orthographic projection of the first vertex 101, the seventh vertex at the point of the orthographic projection of the second vertex, and the seventh vertex at the point of the orthographic projection of the third vertex. The eighth vertex at the orthographic projection, the eleventh vertex, the ninth vertex, and the tenth vertex at the orthographic projection of the fifth vertex.

[0055] The ninth vertex and the tenth vertex are below the eight...

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PUM

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Abstract

The invention relates to the field of connector pads on PCBs, and particularly discloses a connector pad and an anti-pad on a PCB, and the pad comprises a first vertex located on the upper side, a second vertex located on the upper side, a third vertex located in the middle, a fourth vertex located on the lower side, and a fifth vertex located in the middle. The first vertex and the second vertex are located on the same horizontal line, the first vertex is located on the right side of the second vertex, and the horizontal distance between the first vertex and the second vertex is 6-6.5 mils; the third vertex is on the left of the second vertex and the fifth vertex is on the right of the first vertex; and sequentially connecting the first vertex, the second vertex, the third vertex, the fourth vertex and the fifth vertex to form a closed loop to form the connector pad structure on the PCB. The structure of the bonding pad and the anti-bonding pad is improved, the width of the bonding pad of the connector is reduced, the signal integrity is improved in a targeted mode, and the stability in the electronic signal transmission process is improved.

Description

technical field [0001] The invention relates to the field of connector pads on a PCB, in particular to a connector pad and an anti-pad on a PCB. Background technique [0002] With the continuous development of technology, the functional requirements for electronic products are also increasing, and the signal integrity requirements for PCB board design are becoming more and more stringent. The quality of signal transmission directly affects the realization and stability of various functions of the PCB board. For the impedance control on the signal transmission line, generally speaking, the characteristic impedance changes, which will cause the signal to reflect at the point where the impedance is discontinuous. [0003] As the signal rate is originally higher, the requirements for signal quality are getting higher and higher. When the signal is transmitted along the uniform interconnection line, there will be no distortion of the transmission signal. When the signal is trans...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K1/18
CPCH05K1/025H05K1/111H05K1/181H05K2201/10189Y02E60/10
Inventor 魏斌
Owner INSPUR (SHANDONG) COMPUTER TECH CO LTD