Infrared ultrafast laser sapphire cutting method and system
A cutting method and laser cutting head technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of quality impact of cutting parts, sample cracking, disordered and uneven distribution of joint positions, etc., and achieve single pulse uniformity Good, fast processing time, good consistency
Pending Publication Date: 2022-03-25
北京赢圣科技有限公司
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Problems solved by technology
However, for such a low thermal conductivity, hard and brittle material, such accumulated pulse train energy will cause its local ultra-rapid temperature rise, resulting in cracking of the sample, micro-cracks that may exist in the processing area, and disorderly and uneven distribution of joint positions. Influence on the quality of cut parts
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Embodiment 1
[0058] The structure of a system of infrared ultrafast laser sapphire cutting in this embodiment is as follows:
[0059] Such as Figure 1-2 As shown, the system includes a workbench 1 and a main control system 4, the main control system is a computer, and the main control system 4 is located on one side of the workbench 1;
[0060] Wherein, the workbench 1 is also provided with a column 5, the column 5 is provided with a first drive 7 and a first track 6, the first track 6 is provided with a first slider 8, and the first drive 7 is used to drive the first slide The block 8 moves up and down in the first track 6; the first slide block 8 is provided with a second track 9 and a second drive 10, and the second track 9 is provided with a second slide block 11, and the second drive 10 can drive the second drive 10. The slider 11 moves horizontally in the second track 9; the second slider 11 is provided with a laser cutting head 14; the laser cutting head 14 is provided with a movi...
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Abstract
The invention provides an infrared ultrafast laser sapphire cutting method and system. The infrared ultrafast laser sapphire cutting method comprises the steps that (1) a sapphire workpiece is fixed to a workbench through a fixing device; (2) laser emitted by a laser sequentially passes through a shaping light path, a light beam transmission light path and a laser cutting head and then is focused on the surface of the sapphire workpiece on a workbench; the laser cutting head is arranged above the sapphire through the driving system; (3) the laser is an infrared ultrafast laser; and (4) the sapphire workpiece is cut by controlling the advancing speed of the laser beam on the surface of the sapphire workpiece in the X-axis, Y-axis and Z-axis directions. According to the invention, sapphire is cut based on the locked ultrafast laser with high repetition frequency, single pulse work, high single pulse energy and high single pulse energy consistency, the photon consistency is good, and the cutting precision is high.
Description
technical field [0001] The invention relates to the technical field of laser cutting, in particular to a method and system for cutting infrared ultrafast laser sapphire. Background technique [0002] Sapphire is a single crystal of aluminum oxide with a unique lattice structure, wear resistance and wind erosion resistance, and its Mohs hardness is as high as 9, second only to diamond. In the early days, due to its high hardness, wear resistance, gloss and light transmission, and its high processing level requirements and insufficient output, it was scarce. It only appeared as the surface of jewelry and watches, and the price was expensive. [0003] With Apple's use of sapphire as the protective glass for the camera and the Home key, sapphire materials have been widely used in smartphones and wearable devices, and have brought a wider range of applications in aviation, defense, LED, medical, consumer electronics and other fields. incremental space. Among them, LED substrate...
Claims
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IPC IPC(8): B23K26/38B23K26/0622B23K26/70
CPCB23K26/38B23K26/0622B23K26/702
Inventor 不公告发明人
Owner 北京赢圣科技有限公司