Method for prolonging service life of silicon carbide epitaxial wafer carrier

A carrier lifetime and epitaxial wafer technology, applied in gaseous chemical plating, coatings, electrical components, etc., can solve the problems of low carrier lifetime, inability to achieve conductance modulation, etc., to improve carrier lifetime, carbon The effect of vacancy suppression and optimized design

Pending Publication Date: 2022-03-25
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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  • Abstract
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Problems solved by technology

[0007] Aiming at the problem that the current carrier lifetime of silicon carbide epitaxial wafers is low and effective conductance modulation cannot be realized, the present invention provides a method for improving the carrier lifetime of silicon carbide epitaxial wafers

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  • Method for prolonging service life of silicon carbide epitaxial wafer carrier
  • Method for prolonging service life of silicon carbide epitaxial wafer carrier
  • Method for prolonging service life of silicon carbide epitaxial wafer carrier

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Embodiment 1

[0039] Provided in the SiC chemical vapor deposition epitaxy system, using a method of improving the carrier lifetime of silicon carbide epitaxial wafers by optimizing the gradient layer structure, the method for growing epitaxial materials with a withstand voltage of 15kV IGBT structure includes the following steps:

[0040] S1. Select a silicon carbide substrate with a silicon surface that is 4° to the direction, and place the cleaned substrate on the graphite base in the reaction chamber of the SiC epitaxy system.

[0041] S2. Use argon to replace the gas in the reaction chamber, use argon as the flotation gas to drive the graphite base to rotate, turn on the hydrogen switch leading to the reaction chamber, control the pressure of the reaction chamber to gradually increase to 100mbar, and control the flow of hydrogen to gradually increase As large as 100L / min, the reaction chamber is gradually heated to the growth temperature of 1650°C, and the temperature of the reaction c...

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Abstract

The invention provides a method for prolonging the service life of a silicon carbide epitaxial wafer carrier. The method comprises the following steps: S1, placing a silicon-surface silicon carbide substrate on a graphite base; s2, adjusting conditions in the reaction chamber and growing a buffer layer; s3, the growth temperature and pressure are kept unchanged, the C / Si ratio is reduced, and then the C / Si ratio is increased in a linear gradual change mode for first-time growth; s4, keeping the growth temperature and pressure unchanged, and continuing n times of rate switching gradient layer growth; s5, conditions in the reaction chamber are adjusted, and growth of an epitaxial layer is completed; s6, after epitaxial layer growth is completed, the growth source and the doping source are closed, finally, argon is used for inflating the pressure of the reaction chamber to atmospheric pressure, and then the chamber is opened to take the wafer. According to the invention, the gradient layer design is optimized by adopting the method of growing the plating layer in a stepped manner, the purposes of compensating the carbon vacancy generated by the buffer layer and inhibiting the formation of the carbon vacancy of the gradient layer are achieved, and the carrier lifetime of the silicon carbide epitaxial wafer is greatly prolonged.

Description

technical field [0001] The invention belongs to the technical field of semiconductor materials, and in particular relates to a method for improving the carrier lifetime of a silicon carbide epitaxial wafer. Background technique [0002] Silicon carbide (SiC), as the third-generation wide-bandgap semiconductor material, has excellent material properties and has great application potential in the fields of high temperature, high frequency, high power, and radiation resistance, especially 4H-SiC bipolar devices due to The characteristics of conductance modulation can achieve ultra-high withstand voltage and ultra-low on-resistance, especially suitable for high-voltage and ultra-high-voltage applications. [0003] The control of carrier lifetime in ultra-thick and low-doped epitaxial materials for ultra-high voltage power electronic devices (>10kV) is very important for realizing low-power bipolar devices. Studies have shown that low minority carrier lifetime is very unfavor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02C23C16/32C23C16/44
CPCH01L21/02378H01L21/0243H01L21/02529H01L21/0262C23C16/325C23C16/44
Inventor 赵志飞李赟王翼周平李忠辉
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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