Unlock instant, AI-driven research and patent intelligence for your innovation.

Welding process for large-area ceramic copper-clad plate based on IGBT module

A technology of ceramic copper clad laminate and welding process, which is applied in the direction of welding equipment, welding/welding/cutting items, manufacturing tools, etc. It can solve the problems of exceeding the standard value, large area of ​​tin beads, and excessive voids, etc., to delay the heating rate, The effect of preventing overflow

Pending Publication Date: 2022-04-01
YANTAI TAIXIN ELECTRONICS TECH CO LTD
View PDF20 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The welding process between the small-area DBC and the copper substrate is well controlled. When the area of ​​the DBC exceeds a certain size, a large area of ​​tin balls will appear in the traditional welding process, causing the cavity to be too large, exceeding the standard value, and affecting Device performance

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Welding process for large-area ceramic copper-clad plate based on IGBT module
  • Welding process for large-area ceramic copper-clad plate based on IGBT module
  • Welding process for large-area ceramic copper-clad plate based on IGBT module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Based on the welding process of large-area ceramic copper clad laminates of IGBT modules, such as Figure 1-4 As shown, it specifically includes the following steps: DBC printing→chip mounting→copper substrate stencil cleaning→copper substrate printing→chip, DBC, copper substrate, NTC assembly→vacuum reflow soldering→void detection, ceramic copper clad laminate includes copper substrate 1, The first DBC ceramic copper clad laminate 2 , the second DBC ceramic copper clad laminate 3 , solder paste 4 , IGBT chip 5 , NTC thermistor 6 and copper substrate stencil 7 .

[0034] Further, the DBC printing is specifically printing the solder paste 4 onto the upper surface of the second DBC ceramic copper-clad laminate 3 by means of screen printing, and the chip mounting is specifically mounting the IGBT chip 5 on the upper surface of the solder paste 4, and the copper The cleaning of the substrate stencil is specifically carried out by immersing in alcohol at room temperature for...

Embodiment 2

[0043] Take the area as 3000mm 2 Taking DBC welding as an example, the specific implementation steps are as follows:

[0044] Step 1: DBC printing, printing the solder paste 4 onto the upper surface of the second DBC ceramic copper clad laminate 3 by means of screen printing;

[0045] Step 2: chip mounting, the IGBT chip 5 is mounted on the upper surface of the solder paste 4;

[0046] Step 3: Clean the copper substrate stencil 7, soak it in alcohol at room temperature for 10 minutes, and ultrasonically clean it for 30 seconds. The copper substrate stencil 7 matches the second DBC ceramic copper clad laminate 3, and the area ratio of DBC2 is 95%, such as Figure 5 As shown, there are impenetrable holes 72 in the lower left corner and upper right corner of the copper substrate stencil 7 for printing positioning. The opening 71 of the stencil shape is a grooved square structure with a thickness of 0.25mm and a groove width of 0.4mm.

[0047] Step 3: Copper substrate printing: ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a welding process for a large-area ceramic copper-clad plate based on an IGBT module. The welding process comprises the following steps of DBC printing, chip mounting, copper substrate steel mesh cleaning, copper substrate printing, chip, DBC, copper substrate and NTC assembling, vacuum reflow soldering and hole detection. The opening of the steel mesh is in a groove type square shape, and it is guaranteed that the steel mesh is printed after being cleaned; the interval time from printing to welding does not exceed 30 min; the welding process is changed, the heating rate is prolonged, two-time vacuum pumping, first-time low-speed pumping and second-time rapid pumping are carried out in the heat preservation process, bubbles slowly overflow due to the first-time low-speed pumping, part of tin beads cannot be brought out, in order to guarantee cavities, rapid pumping is selected during second-time vacuum pumping, and therefore the welding efficiency is improved. Therefore, the content of the solder paste at the bottom of the DBC can be ensured, and the voidage can be reduced.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a welding process based on a large-area ceramic copper-clad laminate of an IGBT module. Background technique [0002] For high-power insulated gate bipolar transistors (IGBT), among many packaging links, the welding process plays a vital role in the life and reliability of the IGBT module, and is also the core technology of the packaging process. The most important criterion for inspecting soldering quality is the soldering void rate. When the void rate is higher than a certain value, it will affect the heat conduction of the soldering layer, resulting in local overheating of the device and failure. Therefore, the level of soldering voids has a great influence on the performance and long-term reliability of the IGBT module. [0003] IGBT modules are generally packaged by IGBT chips, diode chips, solder, ceramic copper-clad laminates (DBC), bonding wires, heat-dissipating copper...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K1/008B23K1/20B23K101/36
Inventor 姜维宾张茹
Owner YANTAI TAIXIN ELECTRONICS TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com