Heating, heat-insulating and energy-saving wallboard and manufacturing method thereof

A manufacturing method and a technology for wall panels, which are applied in the field of building panels, can solve the problems of poor thermal insulation effect, melting and cracking of wall materials, and difficulty in storing heat by microcapsules, and achieve a good effect of heat storage and heat release.

Pending Publication Date: 2022-04-01
DEHUA TB NEW DECORATION MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, since the board is formed by extruding the masterbatch, compared with the original wood board, there are problems of low strength and poor thermal insulation effect
At the same time, since the plate is formed by extrusion, there are few or almost no gaps inside the plate, making it difficult for the heat of the heating element to be transferred to the microcapsules, making it difficult for the microcapsules to store heat
In addition, during extrusion, the hot pressing temperature is as high as 130-200°C, which will easily cause the wall material of the phase-change microcapsule to overheat, melt and crack, causing the phase-change material to flow out, which will still cause the above-mentioned problem of cracking or warping of the plate

Method used

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  • Heating, heat-insulating and energy-saving wallboard and manufacturing method thereof
  • Heating, heat-insulating and energy-saving wallboard and manufacturing method thereof
  • Heating, heat-insulating and energy-saving wallboard and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A heating and heat preservation energy-saving wallboard, such as figure 1 As shown, it includes a heating layer 1 and an outer layer 2 disposed on at least one side of the heating layer 1 . In this embodiment, the outer layers 2 are respectively disposed on two opposite sides of the heating layer 1 .

[0032] Wherein, the heating layer 1 includes a base plate 11 and a heating element 12 arranged on the base plate 11. The base layer 11 is formed by vertically stacking several wood boards. Phase-change microcapsules loaded on the surface and inside of the wood board. At the same time, the adjacent wood boards are connected by an adhesive layer, and the adhesive layer includes phase change microcapsules. Heating element 11 adopts carbon fiber heating wire, such as figure 2 and image 3 As shown, a serpentine wire groove is opened on the substrate 11, such as Figure 4 As shown, the width and depth of the notch are suitable for the diameter of the carbon fiber heating ...

Embodiment 2

[0048] This embodiment is basically the same as Embodiment 1, and its difference only lies in:

[0049] The heat-preserving and energy-saving wallboard is prepared through the following steps:

[0050] Prepare phase-change microcapsules with phase-change paraffin as core material, polymer compound as wall material, particle size of 40-50 μm, and melamine adhesive. Disperse a part of the phase-change microcapsules in water to make a phase-change microcapsule suspension; mix a part of the phase-change microcapsules with the melamine adhesive at a mass ratio of 0.15:1, and then add 20% flour of the mixture mass , Stir again until there are no particles to make an adhesive.

[0051] S1. Rotary cutting selection of wood boards: select eucalyptus logs, use a shaft-free rotary cutter for rotary cutting, and select a number of high-quality wood boards with no surface defects.

[0052] Board pretreatment: Soak the peeled wood board in hot water at 65°C for 2 hours, take it out after ...

Embodiment 3

[0063] This embodiment is basically the same as Embodiment 1, and its difference only lies in:

[0064] The heat-preserving and energy-saving wallboard is prepared through the following steps:

[0065] Prepare phase-change microcapsules with phase-change paraffin as core material, polymer compound as wall material, particle size of 25-35 μm, and melamine adhesive. Disperse a part of the phase-change microcapsules in water to make a phase-change microcapsule suspension; mix a part of the phase-change microcapsules with the melamine adhesive at a mass ratio of 0.3:1, and then add 30% flour of the mass of the mixture , Stir again until there are no particles to make an adhesive.

[0066] S1. Rotary cutting selection of wood boards: select poplar logs, use a shaft-free rotary cutter for rotary cutting, and select a number of high-quality wood boards with no defects on the surface.

[0067] Wood pretreatment: Soak the rotary-cut wood in hot water at 75°C for 4 hours, take it out ...

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Abstract

The invention relates to the technical field of building boards, in particular to a heating, heat-preservation and energy-saving wallboard and a manufacturing method thereof. The wallboard comprises a heating layer and an outer layer arranged on at least one surface of the heating layer, wherein the heating layer comprises a base plate and a heating piece arranged on the base plate; the base plate comprises a wood plate which is subjected to vacuum pressurization dipping treatment in a phase change microcapsule suspension; in the phase change microcapsule suspension, the particle size of the phase change microcapsule does not exceed 50 [mu] m. According to the method, a vacuum pressure impregnation method is adopted, the phase change microcapsules are impregnated into the wood, the uniform and stable wood veneer with the heat storage performance is obtained, application of the phase change microcapsules to solid wood boards is achieved, and the wallboard with the good heat storage and release effect is obtained.

Description

technical field [0001] The invention relates to the technical field of building panels, in particular to a heat-retaining and energy-saving wall panel and a manufacturing method thereof. Background technique [0002] With the continuous improvement of people's living standards, new demands have been put forward for home decoration panels in addition to being beautiful and practical, especially higher requirements for the functionality of the panels. In order to create a better indoor constant temperature environment, heating wall panels and thermal insulation wall panels came into being. However, traditional thermal insulation wallboards are large in size and mostly made of non-wooden materials, which fail to take advantage of wooden materials. Inorganic materials are generally used as base materials for heating wallboards, which lose temperature quickly and do not have thermal insulation performance. The installation process is cumbersome. [0003] Phase change material i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04B1/80F24D13/02
CPCY02A30/242Y02B30/00Y02B80/10
Inventor 郭广超叶交友沈娟霞罗来朋孙文举彭国青林银友
Owner DEHUA TB NEW DECORATION MATERIAL CO LTD
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