CVD diamond heat conduction jumper wire and preparation process

A diamond and jumper technology, which is applied in the direction of cable/conductor manufacturing, conductive layer on insulating carrier, cooling/ventilation/heating transformation, etc., can solve the problems of huge influence of heat conduction design and great difficulty of shared heat dissipation, and achieve low thermal resistance , high practical value and promotion value, and the effect of increasing solderability

Pending Publication Date: 2022-04-05
SICHUAN YONGXING ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the connection between the overall circuit form and the external heat sink has become a technical problem. At the same time, low thermal resistance and high insulation requirements in the connection process are also common problems.
Not only that, due to the high integration of the circuit, the mutual influence of the heat generation of the components is more obvious, individual high-power components have a great impact on the overall heat conduction design, and it is very difficult to share the heat dissipation method

Method used

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  • CVD diamond heat conduction jumper wire and preparation process
  • CVD diamond heat conduction jumper wire and preparation process
  • CVD diamond heat conduction jumper wire and preparation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0033] like Figure 1 to Figure 5 As shown, the present embodiment provides a CVD diamond heat-conducting jumper and its preparation process, and the heat-conducting jumper is connected between an electronic component and a heat sink. It should be noted that the serial numbers such as "first" and "second" in this embodiment are only used to distinguish similar components, and should not be understood as specific limitations on the scope of protection.

[0034] In this embodiment, the thermally conductive jumper includes a CVD diamond substrate 3, a titanium-tungsten layer 4, a nickel layer 2, and a gold layer 1 arranged sequentially from the inside to the outside. The CVD diamond substrate has an ultra-high thermal conductivity ≥ 1000 W / (m•K). Based on this advantage, it can make it a high-speed heat conduction channel, and the thermal resistance of the heat conduction jumper completed by using this advantage does not exceed 5.8°C / W. Moreover, diamond has a relatively low r...

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Abstract

The invention discloses a CVD (chemical vapor deposition) diamond heat conduction jumper wire, which is connected between an electronic component and a radiator and comprises a CVD diamond substrate and two wrapping layers which are wrapped at the end parts of the CVD diamond substrate in a one-to-one correspondence manner and have C-shaped sections, the wrapping layer comprises a titanium tungsten layer, a nickel layer and a gold layer which are sequentially arranged from inside to outside; the CVD diamond substrate is wrapped with the titanium tungsten layer, and the gold layer is connected with the electronic component and the radiator. According to the technical scheme, the CVD diamond heat conduction jumper wire has the advantages of being simple in structure, reliable in heat conduction and the like, and has high practical value and popularization value in the technical field of electronic components.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a CVD diamond heat-conducting jumper and a preparation process thereof. Background technique [0002] As we all know, temperature is the key and environmental stress that affects the reliability of electronic products. Statistics show that 55% of electronic product failures are related to temperature. Therefore, thermal design plays a vital role in improving the reliability of electronic products. With the continuous improvement of the performance of modern electronic products, the requirements for the portability and miniaturization of electronic products are constantly increasing, and the demand for convenient heat dissipation with high heat flux is becoming more and more urgent. [0003] In particular, the heat conduction design requirements of power components are getting higher and higher when they are used, and their heat conduction usually requires an auxili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01B5/14H01B13/00
Inventor 陈雷王元宇李雄宝
Owner SICHUAN YONGXING ELECTRONICS
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