Separation insulation phase change radiator and heat dissipation method thereof

Abstract

The invention discloses a separation insulation phase change radiator and a heat dissipation method thereof. The radiator comprises a phase change function substrate assembly, a working medium insulation channel assembly and a phase change heat exchanger assembly, and the phase change heat exchanger assembly is composed of a heat dissipation phase change substrate, phase change fins, heat exchange fins and heat exchanger side plates; the working medium insulating channel assembly is divided into a steam insulating channel and a condensation backflow insulating channel, and the functional phase change substrate assembly is composed of a functional phase change substrate shell, a functional phase change substrate capillary structure and a functional phase change substrate cover plate. According to the separation insulation phase change radiator, through working medium phase change heat transfer, the physical characteristics of high phase change evaporation latent heat and uniform temperature heat transfer of phase change heat transfer are fully utilized, the temperature uniformity of temperature gradient distribution of the functional phase change substrate, the heat dissipation phase change substrate and the phase change fins is achieved, and the temperature gradient in the direction perpendicular to the substrate and a flow channel of the phase change fins is effectively reduced; therefore, the surface temperature of the heat exchange fins is improved and distributed more uniformly, and the heat exchange efficiency of the heat exchanger and air fluid is greatly improved.

Description

technical field [0001] The invention relates to a separated insulation phase change radiator and a heat dissipation method thereof. Background technique [0002] With the rapid development of electronic components in power electronics, rail transit, green energy, communications, medical equipment and other market fields: ①The packaging density of electronic devices continues to increase, and its heat flux density continues to increase; ②Electronic products are miniaturized With continuous development, the power is higher and the size is shrinking; ③The demand for heat dissipation of electronic products is increasing. These development trends of electronic products make the problem of overheating of electronic equipment more and more prominent. [0003] The overheating of electronic equipment is the failure of electronic products (the impact of high temperature on electronic products: insulation performance degradation; component damage; thermal aging of materials; low melti...

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Problems solved by technology

And due to the poor thermal conductivity of aluminum or aluminum alloy materials, a large temperature gradient is formed in the Z direction of the fins relative to the substrate

The heat exchange coefficient of conventional air convection radiators is generally 5-25W / (m 2 *K), resulting in larger dimensions and heavier weight of natural convection radiators, and because conventional natural convection radiators are mostly made of aluminum or aluminum alloy, the thermal conductivity is generally 10-220W / m.K, and its heat conduction and heat exchange performance poor

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