Putty glue and preparation method thereof
A glue and putty technology, applied in the direction of adhesives, adhesive types, amide/imide polymer adhesives, etc., can solve the problems of formaldehyde residue in acetal glue, difficult process control of acrylamide, etc., and achieve poor polymerization stability. The effect of saving, changing the polymerization temperature rise and temperature control is difficult, and the production process is simple
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Embodiment 1
[0024] A kind of putty glue, is made up of each material of following mass parts:
[0025]
[0026] The mass ratio of glue to talcum powder is 1:1.33-1:2.1. For white cement plus talc 1:0.4:0.9-1:0.4:1.3
Embodiment 2
[0028] A kind of putty glue, is made up of each material of following mass parts:
[0029]
[0030]
[0031] The mass ratio of glue to talcum powder is 1:1.40-1:2.22; and that of white cement is 1:0.5:0.9-1:0.5:1.1.
Embodiment 3
[0033] A kind of putty glue, is made up of each material of following mass parts:
[0034]
[0035] The mass ratio of glue to talcum powder is 1:1.38-1:1.96 to white cement 1:0.4:1.2-1:0.4:1.5.
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