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Epoxy resin composition, preparation method and application thereof, epoxy resin and application thereof

A technology of epoxy resin and composition, applied in the directions of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of poor bonding performance and high internal stress of red glue, and achieve the goal of improving the thrust of red glue, reducing the Flexural modulus and internal stress, the effect of improving the adhesion of red glue

Pending Publication Date: 2022-04-15
江苏中科科化新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of epoxy resin composition and its preparation method and application, epoxy resin and For its application, the epoxy resin composition contains a specific composition and proportion, so that the epoxy resin thus prepared has improved internal stress and red glue bonding performance when used in packaging materials

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  • Epoxy resin composition, preparation method and application thereof, epoxy resin and application thereof
  • Epoxy resin composition, preparation method and application thereof, epoxy resin and application thereof
  • Epoxy resin composition, preparation method and application thereof, epoxy resin and application thereof

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preparation example Construction

[0039] The second aspect of the present invention provides a kind of preparation method of epoxy resin, it is characterized in that, described preparation method comprises the following steps:

[0040] (1) In the presence of a protective gas, after the first curing agent is heat-treated, the coumarone resin is added for premixing to obtain a premix;

[0041] (2) Melting and kneading the premix, the second curing agent, epoxy resin, accelerator, inorganic filler, release agent, coupling agent and pigment to obtain the epoxy resin composition;

[0042] The usage amount of the first curing agent is 10-15wt% of the total curing agent usage.

[0043]The raw material for preparing epoxy resin in the second aspect of the present invention adopts the composition described in the aforementioned first aspect of the present invention, the epoxy resin involved in the second aspect, curing agent, accelerator, inorganic filler, release agent, Coupling agent and pigment form the epoxy resin...

Embodiment 1

[0080] (1) Take 1 part by weight of the first curing agent novolac resin B1 (12.5wt% of the total weight of the curing agent) and add it to a 3-necked flask, put it into a heating mantle and heat it up to 150°C to heat and melt, and add 1.5 parts by weight of coumarone resin G1, pre-mixing, nitrogen as a protective gas, stirring at 1700rpm for 20 minutes. Pour out the mixture while it is hot, let it cool down, and get the premix H1 after crushing;

[0081] (2) Premix H1, the second curing agent novolac resin B1 (87.5wt% of the total curing agent), epoxy resin, accelerator, inorganic filler, release agent, coupling agent and carbon black in the open Melting and kneading on a type rubber mixer to obtain epoxy resin composition A1, the temperature of melting and kneading is 120 °C, and the time is 20 min, in which epoxy resin, accelerator, inorganic filler, release agent, coupling agent and carbon The amount of black used is shown in Table 1.

Embodiment 2

[0083] (1) Take 0.8 parts by weight of the first curing agent novolac resin B1 (10 wt% of the total weight of the curing agent) and add it to a 3-necked flask, put it into a heating mantle and heat it up to 150°C to heat and melt, and add 2 parts by weight of coumarone resin G1 , pre-mixed, nitrogen gas was introduced as a protective gas, and the stirring speed was turned on at 1800 rpm for 20 minutes. Pour out the mixture while it is hot, let it cool, and get the premix H2 after crushing;

[0084] (2) Premix H2, the second curing agent novolac resin B1 (90wt% of the total curing agent), epoxy resin, accelerator, inorganic filler, release agent, coupling agent and carbon black in open Melt and knead on the rubber mixer to obtain epoxy resin composition A2. The temperature of the melt and knead is 105° C., and the time is 17 minutes. Among them, epoxy resin, accelerator, inorganic filler, release agent, coupling agent and carbon The amount of black used is shown in Table 1.

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Abstract

The invention relates to the technical field of epoxy molding compounds, and discloses an epoxy resin composition, a preparation method and application thereof, epoxy resin and application thereof. The composition is prepared from the following components in parts by weight: 5 to 25 parts of epoxy resin, 5 to 25 parts of curing agent, 0.02 to 3 parts of accelerant, 10 to 89 parts of inorganic filler, 0.01 to 10 parts of release agent, 0.01 to 10 parts of coupling agent, 0.01 to 10 parts of coumarone resin and 0.1 to 0.5 part of pigment. The epoxy resin composition contains specific components and proportions, so that the epoxy resin prepared from the epoxy resin composition has improved internal stress and red glue bonding performance when being used for a packaging material.

Description

technical field [0001] The invention relates to the technical field of epoxy molding compound, in particular to an epoxy resin composition and its preparation method and application, epoxy resin and its application. Background technique [0002] In recent years, the packaging industry of integrated circuits and semiconductor devices has developed rapidly with the rapid development of semiconductors. The development of light and thin terminals should guide the development of packaging technology to miniaturization, thinning and ultra-large-scale development, and at the same time, higher requirements are put forward for the reliability and other performance of packaged products. In the process of protecting the internal circuit, the plastic packaging compound is subjected to impacts from different external environments such as temperature, pressure, and humidity. Environmental changes cause different stresses on the plastic packaging compound itself. When the stress is too lar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08
Inventor 李政李刚王善学卢绪奎
Owner 江苏中科科化新材料股份有限公司