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Arc height measurement of overlapping bond lines

A connection and height technology, applied in the field of arc height inspection equipment, can solve the problem of not solving this need

Pending Publication Date: 2022-04-15
EMAGE VISION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The prior art does not address this need

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  • Arc height measurement of overlapping bond lines
  • Arc height measurement of overlapping bond lines
  • Arc height measurement of overlapping bond lines

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Embodiment Construction

[0022] Hereinafter, bonding wires, bonded wires, interconnecting wires, and interconnections will be used interchangeably when describing the drawings. It is important to note that the same reference numerals are given to the same or similar components and components in different drawings for greater clarity.

[0023] Such as figure 1 As shown in , the imaging system comprises an imaging device 8 suitably mounted with an optical lens 10 which in turn is integrated into an illumination module 12 . An XY positioner 16 enables positioning of the image capture system in the X and Y axes, and is integrated into the Z positioner 14 to enable movement 18 of the imaging system along the Z axis or alternatively up and down. It should be noted that the XYZ positioners can operate synchronously to enable fast positioning to achieve a maximum in-focus image of the bond wires across the silicon chip. The imaging system is capable of capturing high-resolution images at different locations...

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Abstract

An apparatus and method for measuring the arc height of an overlapping bond wire interconnecting pads of a single or stacked silicon chip to pads of a substrate, employing the steps of: focusing an optical component at a plurality of points of the bond wire including the overlapping bond wire, capturing an image of the bond wire at each predetermined focus point; calculating the height of each connecting line relative to the reference plane; and tabulating the height data using the X, Y, and Z coordinates.

Description

technical field [0001] The present invention relates to a method for determining the height of a bond wire and subsequently the arc height of a bond profile between a pad of a semiconductor chip and a pad of a substrate, which may be plastic (e.g., a BGA substrate) or a metal substrate (e.g., a lead frame). Check the equipment. The invention is particularly useful, but not limited to, determining the profile of bond wire arcs that include closely overlapping bond wires. [0002] Background of the invention [0003] Wire bonding is used during semiconductor assembly as a means of making electrical interconnections between semiconductor chips and substrates such as lead frames and printed circuit boards. Wires made of gold, aluminum and copper are commonly used. The interconnection process is automated and it is important to ensure that the bonded wires maintain a certain profile including minimum height, length and distance between adjacent electrical connection pads. Wire ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/24G01B11/06G06T7/00G06T7/60
CPCG06T7/60G06T2207/30148G01N2021/95661G01N21/956G01B11/002G01B11/0608H01L2224/48091H01L2224/49113H01L2224/48465H01L2224/4917H01L2224/48227H01L2224/45144H01L2224/45124H01L2224/45147H01L24/45H01L24/49H01L24/85H01L2224/859H01L2224/4909H01L24/78H01L2224/789H01L24/48H04N23/56H04N23/67H04N23/74H01L2924/00014H01L2924/00015G01B11/03G01B11/022H01L21/67288G01N21/9501G06T2207/20072G06T11/206H04N23/695
Inventor 黄循威维克托·费多普拉枸夫
Owner EMAGE VISION