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Heat treatment method for selective laser melting of AlSi10Mg alloy

A technology of selective laser melting and heat treatment, which is applied in additive manufacturing, additive processing, etc., can solve the problems of insignificant effect of microstructure regulation and low stability of mechanical properties, and can meet the requirements of performance stability and toughness, improve The effect of plastic elongation

Active Publication Date: 2022-04-26
COMAC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The traditional annealing or aging heat treatment system is not completely suitable for selective laser melting of AlSi10Mg alloy, the control effect of microstructure is not obvious, and the stability of mechanical properties is low

Method used

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  • Heat treatment method for selective laser melting of AlSi10Mg alloy
  • Heat treatment method for selective laser melting of AlSi10Mg alloy
  • Heat treatment method for selective laser melting of AlSi10Mg alloy

Examples

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Effect test

Embodiment 1

[0057] This embodiment provides a heat treatment method for selective laser melting of AlSi10Mg alloy, using AlSi10Mg alloy raw material powder with a particle size of 20-63 μm and an angle of repose of 38° for selective laser melting. The microscopic morphology of AlSi10Mg alloy raw material powder is as follows: image 3 As shown, the SEM microstructure photos of the deposited aluminum-silicon alloy components are as follows Figure 4a As shown, among them, Figure 4b for Figure 4a The high-magnification topography of P1 in the middle, Figure 4c for Figure 4a The high-magnification topography of P2 in the middle.

[0058] refer to Figure 4b , the overlap of the molten pool is composed of three morphologies: coarse-grained zone 1, heat-affected zone (HAZ) 2 and fine-grained zone 3. The coarse-grained zone 3 is located in the center of the remelting zone of the molten pool. The grains in this zone are re-nucleated and grown after secondary melting. The heat-affected ...

Embodiment 2

[0072] This embodiment provides a heat treatment method for selective laser melting of AlSi10Mg alloy, the difference is that AlSi10Mg alloy raw material powder with a particle size of 25-53 μm and an angle of repose of 36° is used for selective laser melting.

[0073] S21) Stress relief annealing treatment step: heat the heat treatment furnace to 280°C at a heating rate of 4°C / min, put the aluminum-silicon alloy component into the heat treatment furnace for stress relief annealing treatment, and heat it for 2.5 hours. The aluminum-silicon alloy component is cooled to room temperature with the furnace at a cooling rate of 8°C / min.

[0074] S22) Solution treatment step: Heat the heat treatment furnace to 535 °C at a heating rate of 8 °C / min, place the aluminum-silicon alloy components that have been subjected to stress relief annealing in the heat treatment furnace for solution treatment, and heat them for 1.5 hours. The treated aluminum-silicon alloy component was taken out, p...

Embodiment 3

[0082] This embodiment provides a heat treatment method for selective laser melting of AlSi10Mg alloy, the difference is that AlSi10Mg alloy raw material powder with a particle size of 22-60 μm and an angle of repose of 34° is used for selective laser melting.

[0083] S31) Stress relief annealing treatment step: heat the heat treatment furnace to 240°C at a heating rate of 6°C / min, put the aluminum-silicon alloy component into the heat treatment furnace for stress relief annealing treatment, and heat it for 4 hours. The silicon alloy component is cooled to room temperature with the furnace at a cooling rate of 7°C / min.

[0084] S32) Solution treatment step: Heat the heat treatment furnace to 520 °C at a heating rate of 7 °C / min, place the aluminum-silicon alloy components that have been subjected to stress relief annealing in the heat treatment furnace for solution treatment, and heat them for 1.6 hours. The treated aluminum-silicon alloy components were taken out, and placed...

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Abstract

The embodiment of the invention discloses a heat treatment method for selective laser melting of AlSi10Mg alloy, AlSi10Mg alloy raw material powder is made into an aluminum-silicon alloy component based on a selective laser melting technology, and the heat treatment method comprises a stress relief annealing treatment step, a solution treatment step and an aging treatment step. According to the method, the printing residual stress can be effectively eliminated, the structure can be homogenized, the plastic elongation is improved, and the eutectic silicon and Mg2Si particles play roles in precipitation strengthening and dispersion strengthening.

Description

technical field [0001] The present application relates to the technical field of heat treatment of metal materials, in particular to a heat treatment method for selective laser melting of AlSi10Mg alloy. Background technique [0002] Metal material additive manufacturing technology, also known as 3D printing technology and laser rapid prototyping technology, mainly uses metal powder particles or metal wire as raw materials, pre-layered processing through CAD models, and uses high-power laser beams to melt and accumulate growth, directly from CAD The model completes the "near net shape" of high-performance components in one step. Metal material additive manufacturing technology can be divided into selective laser melting technology (Selective LaserMelting-SLM) and laser cladding deposition technology (LaserMeltingDeposition-LMD). Selective laser melting technology has attracted much attention because of its high forming precision and the ability to prepare complex structural...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22F1/043B22F10/64C22C21/02B33Y10/00B33Y40/20
CPCC22F1/043B22F10/64C22C21/02C22F1/002B33Y10/00B33Y40/20Y02P10/25
Inventor 黄文静张曦梁恩泉晁灿章骏
Owner COMAC
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