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Thermally conductive silicone composition and method for producing same

A manufacturing method and thermal conductivity technology, which is applied in the field of thermal conductive silicone composition, can solve problems such as insufficient effects, and achieve the effects of low slurry viscosity, improved ejection performance and formability

Pending Publication Date: 2022-05-10
FUJI POLYMER INDUSTRIES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for particles with a large specific surface area and a small particle size, the effect of suppressing the increase in viscosity is often insufficient when only treated with such a silane coupling agent having a long-chain alkyl group. It is desired to further reduce the viscosity of the slurry to improve spraying exportability, processability

Method used

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  • Thermally conductive silicone composition and method for producing same
  • Thermally conductive silicone composition and method for producing same
  • Thermally conductive silicone composition and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0123]

[0124] Use micropowder α-alumina (BET specific surface area (A BET )6.7m 2 / g, average particle size (d 50 ) 0.27μm, X = 24.815 (B-1) 150.0g, decyltrimethoxysilane (molecular weight = 262.5) (C-1) 1.0g as the first surface treatment agent, passed through Wonder Crusher WC-3 (OSAKA CHEMICAL Co., Ltd.) was subjected to dry surface treatment.

[0125]

[0126] Add two-terminal vinyl dimethylsilyl polydimethylsiloxane as a second surface treatment agent to the thermally conductive inorganic filler after the first surface treatment: Viscosity 350mm 2 / s (D-1) 1.5 g, surface-treated with Wonder Crusher WC-3 (manufactured by OSAKA CHEMICAL Co., Ltd.). The double-stage treated inorganic filler was heat-treated at 120° C. for 12 hours to obtain a double-stage surface-treated thermally conductive filler.

[0127]

[0128] Using the thermally conductive filler adjusted as described above, the composition shown in Table 1 was mixed using a rotary revolution mixer (MAZERU...

Embodiment 2~5、 comparative example 1~5

[0130] Except having set to the composition shown in Table 1, it implemented similarly to Example 1. The conditions and results are summarized in Table 1. The mass of each filler was set as the mass (g) in terms of charging when the matrix resin was set to 100 g.

[0131] Table 1

[0132]

[0133] Can confirm by above result, if embodiment 1 and comparative example 1, embodiment 2 and comparative example 2, embodiment 3 and comparative example 3, embodiment 4 and comparative example 4, embodiment 5 and comparative example 5 carry out respectively In comparison, the shear viscosity of the thermally conductive compound of the composition of each Example was low, and it was possible to improve ejection property and molding processability by this. This is considered to be an advantage based on the combination of the first surface treatment and the second surface treatment.

[0134]

Embodiment 6

[0136] As the matrix resin component (A), a two-component heat-curable silicone polymer was used. A component (A-3a) to which a base polymer component and a platinum-based metal catalyst were previously added, and a component (A-3b) to which a base polymer component and a crosslinking component were previously added were used. The thermally conductive inorganic filler was subjected to the first surface treatment and the second surface treatment in the same manner as in Example 1. The components and addition amounts are described in Table 2. The shear viscosities at 23° C. of the compound after mixing were 1780 Pa·s and 1700 Pa·s. This composite was sandwiched between polyester (PET) films, and a sample rolled to a thickness of 2.0 mm was held at 100° C. for 15 minutes to heat-cure it. Table 2 shows the hardness (Asker-C) and thermal conductivity of the obtained thermally conductive silicone sheet.

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Abstract

The present invention relates to a thermally conductive silicone composition comprising a silicone polymer and a thermally conductive inorganic filler, the inorganic filler being subjected to a surface treatment with a first surface treatment agent comprising an organosilane compound represented by R11SiR12x (OR13) 3-x (wherein R11SiR12x (OR13) 3-x, and a second surface treatment agent comprising an organosilane compound represented by R11SiR12x (OR13) 3-x (wherein R11SiR12x (OR13) 3-x (wherein R11SiR12x (OR13) 3-x (wherein R11SiR12x (OR13) 3-x), and a second surface treatment agent containing a silicone polymer having a dynamic viscosity of 10-1000 mm2 / s and not having a hydrolyzable group, in which R11 is a monovalent aliphatic hydrocarbon group having 1-18 carbon atoms, a monovalent aromatic hydrocarbon group having 6-30 carbon atoms, a hydrocarbon group having an alkoxysilyl group, or the like, R12 is a methyl group, or the like, and R13 is a hydrocarbon group having 1-4 carbon atoms, or the like, and in which R11 is a monovalent aliphatic hydrocarbon group having 1-18 carbon atoms, a monovalent aromatic hydrocarbon group having 6-30 carbon atoms, a hydrocarbon group having an alkoxysilyl group, or the like, and R13 is a hydrocarbon group having 1-4 carbon atoms, or the like. As a result, provided are: a thermally conductive silicone composition which has low slurry viscosity and high discharge properties and moldability; and a method for producing the thermally conductive silicone composition.

Description

technical field [0001] The present invention relates to a thermally conductive silicone composition suitable for being sandwiched between a heat generating portion and a radiator of an electric / electronic component or the like, and a method for producing the same. Background technique [0002] In recent years, the performance of semiconductors such as CPUs has been greatly improved, and the amount of heat generated has also increased accordingly. Heat sinks are attached to electronic components such as semiconductors that generate heat, and thermally conductive silicone grease, sheets, etc. are used to improve the adhesion between semiconductors and heat sinks. In Patent Document 1, a silane coupling agent having a long-chain alkyl group on the surface of a thermally conductive inorganic filler is proposed in order to suppress an increase in slurry viscosity when mixed with a base polymer and to improve dischargeability and molding processability. The method of processing. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K9/06C08K3/22C08K3/28C09K5/14
CPCC08K9/06C08K3/22C08K3/28C09K5/14C08L83/04H01L23/42H01L23/3737C08K9/08C08K2003/2227C08K2003/282C08G77/04C08K2201/001
Inventor 岩井亮小林真吾木村裕子
Owner FUJI POLYMER INDUSTRIES CO LTD