Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof

A graphene composite and heat-dissipating coating technology, which is applied in coatings, adhesives, adhesive types, etc., can solve the problem that heat-dissipating materials cannot meet the high heat dissipation requirements of electronic equipment, and achieve improved electrical conduction and heat dissipation performance, high thermal conductivity, and high efficiency. The effect of heat dissipation

Active Publication Date: 2022-05-13
桂林清研皓隆新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The object of the present invention is to provide a graphene composite heat dissipation coating and its preparation method, as well as its heat dissipation tape a

Method used

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  • Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof
  • Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof
  • Graphene composite heat dissipation coating and preparation method thereof, and heat dissipation adhesive tape and preparation method thereof

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preparation example Construction

[0046] The present invention also provides a kind of preparation method of graphene composite heat-dissipating paint, comprises the following steps:

[0047] (1) Mix C60, graphene, and heat conducting powder, carry out hydrothermal reaction, then carry out room temperature drying, freezing, and room temperature drying to the product successively to obtain graphene composite heat dissipation powder;

[0048] (2) After mixing the silicone-modified acrylic resin and additives, adding graphene composite heat dissipation powder, water, and dispersant to adjust the viscosity to obtain graphene composite heat dissipation coating.

[0049]In the present invention, the temperature of the hydrothermal reaction in step (1) is preferably 120-180°C, more preferably 126-171°C, more preferably 154°C; the time of the hydrothermal reaction is preferably 8-12h, more preferably 9-11h, more preferably 10h.

[0050] In the present invention, the drying time at room temperature in step (1) is inde...

Embodiment 1

[0075] This embodiment provides a heat dissipation adhesive tape, the preparation method of which comprises the following steps:

[0076] (1) 1 part of C60, 5 parts of graphene oxide, 0.5 parts of Al 2 o 3 (Particle size is 40nm) mixed with 0.5 parts of SiC (particle size is 40nm), hydrothermally reacted at 160°C for 9h, then the product was dried at room temperature for 8h, frozen at -20°C for 48h, and dried at room temperature for 8h to obtain graphene composite heat dissipation pink;

[0077] (2) 8 parts of graphene composite cooling powder, 35 parts of water, 0.5 parts of KH560 were ultrasonically dispersed for 2 hours to obtain graphene slurry; Stir at 1100r / min for 20min, then add graphene slurry, stir at 1500r / min for 60min, and adjust the viscosity to 900mpa.s with water to obtain a graphene composite heat-dissipating coating;

[0078] (3) 35 parts of TPU and 2 parts of Si 3 N 4 (Particle size is 10μm) mixing, under the condition of vacuum degree of -0.06MPa, vacu...

Embodiment 2

[0080] This embodiment provides a heat dissipation adhesive tape, the preparation method of which comprises the following steps:

[0081] (1) 2 parts of C60, 5 parts of graphene oxide, 1.5 parts of Al 2 o 3 (particle size is 30nm) and 0.5 parts of SiC (particle size is 30nm) mixed, hydrothermal reaction at 140°C for 12h, and then the product is dried at room temperature for 8h, -20°C for 48h, and room temperature for 8h to obtain graphene composite heat dissipation pink;

[0082] (2) Ultrasonic disperse 7 parts of graphene composite cooling powder, 35 parts of water, and 0.5 parts of sodium polyacrylate for 2 hours to obtain graphene slurry; mix 15 parts of silicone-modified acrylic resin, 0.02 parts of BYK028, and 0.02 parts of Digo 245 Stir at 1500r / min for 30min, then add graphene slurry, stir at 1600r / min for 90min, and adjust the viscosity to 1000mpa.s with water to obtain a graphene composite heat-dissipating coating;

[0083] (3) 35 parts of silicone modified acrylic...

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Abstract

The invention belongs to the technical field of heat dissipation adhesive tapes, and discloses a graphene composite heat dissipation coating and a preparation method thereof, and a heat dissipation adhesive tape and a preparation method thereof. Graphene is filled with C60 and heat-conducting powder through a hydrothermal reaction and a normal-temperature drying-freezing-normal-temperature drying mode, a graphene composite heat dissipation micropore structure is formed, and then the graphene composite heat dissipation coating is formed by combining the graphene composite heat dissipation micropore structure with organic silicon modified acrylic resin, a dispersing agent, water and auxiliaries. The heat dissipation adhesive tape is composed of a three-layer structure, the lowest layer is a carrier of the heat dissipation adhesive tape, the middle layer has heat conduction and insulation effects, and the uppermost layer is a coating layer formed by graphene composite heat dissipation paint and mainly has a heat dissipation effect. The heat dissipation adhesive tape is directly pasted into an electronic component, and efficient heat dissipation can be achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation tapes, in particular to a graphene composite heat dissipation coating and a preparation method thereof, and a heat dissipation tape and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, electronic components such as CPU and LED are tending to higher power and integration, which puts forward higher requirements on the heat dissipation performance of equipment. Poor heat dissipation will not only lead to an increase in operating temperature and shorten the service life, but also may cause functional failure, and more seriously, may cause production accidents. Therefore, the good heat dissipation performance of electronic components is the key support to ensure the stable operation of the new generation of high-power electronic devices. [0003] At present, while high-performance SOC chips bring powerful computing capabilities t...

Claims

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Application Information

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IPC IPC(8): C09D133/00C09D7/61C09J7/30C09J7/40C09J175/04C09J11/04C09J133/00
CPCC09D133/00C09D7/61C09J7/30C09J7/40C09J175/04C09J11/04C09J133/00C08K2003/2227C08K2201/005C09J2203/326C09J2301/122C09J2301/408C08K3/042C08K3/04C08K3/22C08K3/34
Inventor 刘果
Owner 桂林清研皓隆新材料有限公司
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