Electronic component and board having the same
A technology for electronic components and capacitors, which is applied in the direction of electrical components, printed circuits connected to non-printed electrical components, fixed capacitor electrodes, etc., and can solve problems such as easy reliability deterioration.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0051] Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
[0052] Directions will be defined in order to clearly describe exemplary embodiments in the present disclosure. The X direction, Y direction and Z direction in the drawings refer to the length direction, width direction and thickness direction of the multilayer capacitor and the electronic component, respectively.
[0053] Here, the Z direction may be used as the same concept as the stacking direction in which the dielectric layers are stacked in the present exemplary embodiment.
[0054] figure 1 is a schematic perspective view illustrating a multilayer capacitor according to an exemplary embodiment in the present disclosure, Figure 2A and Figure 2B are shown separately figure 1 A plan view of the first internal electrode and the second internal electrode of the multilayer capacitor, image 3 is along figure 1 The cross-sec...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Roughness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


