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Electronic component and board having the same

A technology for electronic components and capacitors, which is applied in the direction of electrical components, printed circuits connected to non-printed electrical components, fixed capacitor electrodes, etc., and can solve problems such as easy reliability deterioration.

Pending Publication Date: 2022-05-13
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the case of an electronic component using such a metal frame, the surface of the metal frame is smooth, so when the electronic component is mounted on a circuit board, the reliability of the metal frame at the portion in contact with the electrode pad of the circuit board is reliable. sex may be easily deteriorated

Method used

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  • Electronic component and board having the same
  • Electronic component and board having the same
  • Electronic component and board having the same

Examples

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Embodiment Construction

[0051] Hereinafter, exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0052] Directions will be defined in order to clearly describe exemplary embodiments in the present disclosure. The X direction, Y direction and Z direction in the drawings refer to the length direction, width direction and thickness direction of the multilayer capacitor and the electronic component, respectively.

[0053] Here, the Z direction may be used as the same concept as the stacking direction in which the dielectric layers are stacked in the present exemplary embodiment.

[0054] figure 1 is a schematic perspective view illustrating a multilayer capacitor according to an exemplary embodiment in the present disclosure, Figure 2A and Figure 2B are shown separately figure 1 A plan view of the first internal electrode and the second internal electrode of the multilayer capacitor, image 3 is along figure 1 The cross-sec...

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Abstract

The invention provides an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite ends of the capacitor body, respectively; and a pair of metal frames including a pair of connection portions and a pair of mounting portions, the pair of connection portions being connected to the pair of external electrodes, respectively, and the pair of mounting portions being connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions includes a rough surface.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0140954 filed with the Korean Intellectual Property Office on October 28, 2020, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0002] The present disclosure relates to an electronic component and a board including the same. Background technique [0003] A multilayer capacitor has been used in various electronic devices because it has a small size and can achieve high capacitance. [0004] Recently, with the rapid development of eco-friendly vehicles and electric vehicles, the importance of electric drive systems inside vehicles has increased. Accordingly, demand for multilayer capacitors required for electric drive systems has also increased. [0005] Multilayer capacitors have been required to have high levels of thermal reliability, electrical reliability, and mechanical reliability in order to be used as components of vehicles....

Claims

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Application Information

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IPC IPC(8): H01G4/232H01G4/248H01G4/30H01G4/12H05K1/18
CPCH01G4/232H01G4/248H01G4/30H05K1/181H01G4/12H01G2/065H01G4/012H01G4/1209Y02T10/70H01G2/06H01G4/1227H05K1/111
Inventor 宋京主赵范俊安胜旻
Owner SAMSUNG ELECTRO MECHANICS CO LTD