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Double-cavity ceramic packaging shell and preparation method thereof

A ceramic packaging and cavity technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve problems such as inability to adapt to high-frequency transmission requirements, device high-frequency signal transmission obstacles, and limited signal transmission capabilities. , to achieve the effect of improving transmission capacity, reducing size, reducing reflection and loss

Active Publication Date: 2022-05-13
HEFEI SHENGDA ELECTRONIC TECH IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In vertical signal transmission, the coaxial-like transmission structure is the most widely used. The commonly used structural form is to punch holes next to the center conductor, but this form of signal transmission capacity is limited and cannot meet the requirements of high-frequency transmission.
At the same time, as the frequency increases, densely distributed microwave devices will form resonance peaks at specific resonance points, which will hinder the high-frequency signal transmission of the device

Method used

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  • Double-cavity ceramic packaging shell and preparation method thereof
  • Double-cavity ceramic packaging shell and preparation method thereof
  • Double-cavity ceramic packaging shell and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Such as Figure 1-5 As shown, a dual-cavity ceramic package housing includes a rectangular bottom plate 10 and a rectangular ring frame 20 connected to the bottom plate 10 . The bottom plate 10 is made of an aluminum nitride ceramic bottom plate. A partition wall 21 is arranged inside the ring frame 20 to form a double cavity structure. The partition wall 21 is arranged parallel to the short sides of the ring frame 20 . The thickness of the partition wall 21 is the same as that of the main body of the ring frame 20, and the connection between the partition wall 21 and the ring frame 20 is connected with rounded corners to increase the mechanical strength of the package and prevent deformation.

[0045] The upper surface and the lower surface of the bottom plate 10 are all provided with a metallized layer 11, the thickness of the metallized layer 11 is about 50 μm, and the material of the metallized layer is Cu; A Ni layer in contact with layer 11 and an Au layer in con...

Embodiment 2

[0063] On the basis of the structure of Embodiment 1, a double-cavity ceramic packaging casing includes an aluminum nitride ceramic base plate 10 and a Kovar metal ring frame 20 . The aluminum nitride ceramic base plate 10 is 16.0mm long, 11.0mm wide, and 0.60mm thick; the middle part of the ring frame 20 is provided with a partition wall, and the thickness of the partition wall is 0.55mm consistent with that of the ring frame, and the connection between the partition wall and the ring frame wall is made of R0.30 round corner transition.

[0064] The aluminum nitride ceramic base plate 10 adopts DPC or other coating process to prepare the metallization layer 11, the metallization layer is a Cu layer with a thickness of 50 μm; the surface coating layer 111 is a nickel-gold layer with a total thickness of 60-70 μm; 12 The thickness is 30 μm.

[0065] At the joint between the bottom plate 10 and the ring frame 20, the non-metallized solder resist 13 arranged around the bottom pl...

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Abstract

The invention relates to the technical field of ceramic packaging, in particular to a double-cavity ceramic packaging shell and a preparation method thereof. The ring frame comprises a bottom plate and a ring frame body connected with the bottom plate, and a partition wall is arranged in the ring frame body to form a double-cavity structure. In the radio-frequency signal transmission area of the packaging shell, radio-frequency signal transmission holes penetrating through the bottom plate are formed in the bottom plate, and the radio-frequency signal transmission holes comprise a central radio-frequency signal transmission hole and four edge grounding holes arranged around the central radio-frequency signal transmission hole in a cross shape. An arc-shaped metal wall is arranged between every two adjacent holes of the edge grounding holes with the center radio frequency signal transmission hole as the circle center, and the four arc-shaped metal walls form a discontinuous circular ring with the center radio frequency signal transmission hole as the center. The packaging shell provided by the invention can reduce signal interference in a chip packaging process and improve the integrity of high-frequency signal transmission.

Description

technical field [0001] The invention relates to the technical field of ceramic packaging, in particular to a double-cavity ceramic packaging shell and a preparation method thereof. Background technique [0002] With the continuous development of semiconductor technology and the continuous improvement of system packaging technology, the frequency requirements for signal transmission of devices are also getting higher and higher. At the same time, in order to reduce the volume of the package, more and more functional devices are integrated on the same substrate to achieve different functions. In order to meet the requirements of packaging airtightness, thermal expansion characteristics, and electrical properties, ceramic packaging shells with high reliability have become the mainstream direction of IC packaging. [0003] The metal ring frame welded ceramic plate structure can form a separate sealed cavity. Since the outer shell is a fully sealed structure, it can largely avoi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L21/48H01L23/552
CPCH01L23/49548H01L23/552H01L21/4821H01L23/08
Inventor 苗冠南戴端钟永辉方军曾辉史常东
Owner HEFEI SHENGDA ELECTRONIC TECH IND CO LTD