Integrated circuit processing technology

Abstract

The invention relates to the field of integrated circuits, in particular to an integrated circuit processing technology, a grinding device is used for grinding a wafer, and the grinding efficiency is high. The method comprises the following steps: S1, heating blocky high-purity polycrystalline silicon in a crucible until the blocky high-purity polycrystalline silicon is molten, and inserting a seed crystal into the crucible after the temperature of molten silicon slurry is stable; s2, gradually lifting the seed crystal upwards to form a crystal bar until the crystal bar is completely separated from the liquid level to obtain a complete crystal bar; s3, after the crystal bar is processed, the crystal bar is cut into slices, and a wafer is obtained; s4, the wafer is sent into a grinding device, and the surface layer of the wafer is ground; s5, carrying out etching, flaw removal, polishing and cleaning on the ground wafer to obtain a wafer; and S6, manufacturing a circuit and an electronic element on the wafer, and after a probe testing process, performing construction to obtain the integrated circuit.

Description

technical field [0001] The present invention relates to the field of integrated circuits, in particular to an integrated circuit processing technology. Background technique [0002] An integrated circuit, also known as a chip, is a tiny electronic device or component. It adopts a certain process to interconnect various components and wirings required in a circuit, make them on a small or several small semiconductor wafers or dielectric substrates, and then package them to form the functional structure required on the circuit. ; In this way, all components are formed into a whole, so as to make electronic components miniaturized, intelligent, reduce power consumption and improve reliability. [0003] Wafers are the most important raw material for making integrated circuits. When making integrated circuits, wafers need to be ground on the surface. However, the grinding efficiency of the existing grinding equipment is low, which affects the production efficiency. SUMMARY OF ...

AI Technical Summary

Problems solved by technology

[0003] Wafer is the most important raw material for the production of integrated circuits. When making integrated circuits, the surface of the wafer needs to be ground. However, the grinding efficiency of the existing grinding equipment is low, which affects the production efficiency.

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