Indium phosphide grinding process and indium phosphide

Abstract

The invention relates to the technical field of semiconductor material processing, and particularly discloses an indium phosphide grinding process and indium phosphide. The invention discloses an indium phosphide grinding process. The indium phosphide grinding process comprises the following steps: S1, primary grinding: carrying out primary grinding by adopting a water grinding method; s2, second grinding is conducted, specifically, first grinding liquid is used for grinding, the first grinding liquid comprises first grinding particles, and the particle size of the first grinding particles is 8-13 microns; and S3, third grinding is conducted, specifically, second grinding liquid is used for grinding, the second grinding liquid comprises second grinding particles, and the particle size of the second grinding particles is 4-6 microns. The indium phosphide grinding process is high in efficiency, and the grinding removal efficiency can reach 3.35-3.57 mu m / min; the indium phosphide grinding process is simple in process and good in grinding effect, the surface roughness of indium phosphide ground through the indium phosphide grinding process reaches 0.35-1.02 microns, damage to the surface of indium phosphide is small after grinding, and the surface scratch rate reaches 5.21-5.86%.

Description

technical field [0001] The present application relates to the technical field of semiconductor material processing, and more particularly, to an indium phosphide grinding process and indium phosphide. Background technique [0002] With the rapid development of my country's economy and the rise of electronic products such as mobile communications, the demand for various semiconductor materials such as monocrystalline silicon, polycrystalline silicon, gallium arsenide, and indium phosphide continues to grow, and semiconductor materials must be processed before they are applied. , In the processing technology, the grinding step of the semiconductor is very important, which directly affects the processing quality of the semiconductor material. [0003] At present, most of the grinding methods used in indium phosphide grinding are wet grinding. Indium phosphide is ground and thinned on the grinding disc under the action of the grinding liquid. Generally, the grinding liquid includ...

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Problems solved by technology

[0004] In view of the above-mentioned related technologies, the applicant found that after the grinding is completed, after the indium phosphide is etched, there will be a small amount of fine scratches on the surface of the indium phosphide, which will affect the performance of the indium phosphide and the operation of the subsequent steps

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