Low-temperature thermoelectric device and preparation method thereof
A technology of thermoelectric devices and thermoelectric elements, applied in the manufacture/processing of thermoelectric devices, parts of thermoelectric devices, thermoelectric devices using only Peltier or Seebeck effect, etc., can solve the problems of poor thermoelectric properties of p-type bismuth-antimony alloys, and achieve Compact structure, high cooling temperature difference, easy welding effect
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[0039] see figure 2 , the present invention also provides a preparation method of a low-temperature thermoelectric device, comprising the following steps:
[0040] Step S110: Provide N-type thermoelectric elements and P-type thermoelectric elements.
[0041] In some embodiments, the N-type thermoelectric element is a low-temperature thermoelectric material BiSb, and the P-type thermoelectric element is Tl 2 Ba 2 Ca 2 Cu 3 O 10 superconducting material.
[0042] In some of these embodiments, the size of the N-type thermoelectric element is 1.2×1×5mm 3 or 2.4×2×7mm 3 , the size of the P-type thermoelectric element is 1.2×0.5×5mm 3 or 2.4×1×7mm 3 .
[0043] Step S120: Welding the two ends of the N-type thermoelectric element and the P-type thermoelectric element on the guide plate respectively.
[0044]It can be understood that in this embodiment, a thermoelectric element is composed of an n-type thermoelectric element and a p-type thermoelectric element, and the two ...
Embodiment 1
[0055] In this embodiment 1, a method for manufacturing a low-temperature thermoelectric device specifically includes the following steps:
[0056] Clean the copper deflector and the insulating and thermally conductive ceramic substrate, and weld them together with a copper electrode. The n-type BiSb thermoelectric material was cut to a size of 1.2 × 1 × 5 mm 3 The n-type thermoelectric element, the Tl 2 Ba 2 Ca 2 Cu 3 O 10 The superconducting material is cut to size 1.2×0.5×5mm 3 p-type thermoelectric element. The thermoelectric element is composed of an n-type thermoelectric element and a p-type thermoelectric element, the two ends are respectively welded on the copper guide plate with copper electrodes, and the power line is welded on the copper guide plate. Connect the power cord to the power supply and input current into the loop through the power supply. When the temperature of the hot end of the low temperature thermoelectric device is 90K and the input current ...
Embodiment 2
[0058] In order to better connect the ceramic substrate and the copper guide plate together, the surface of the insulating ceramic substrate is plated with copper. Weld the copper deflector and the copper-clad ceramic substrate together with a copper electrode. The n-type BiSb thermoelectric material was cut to a size of 1.2 × 1 × 5 mm 3 The n-type thermoelectric element, the Tl 2 Ba 2 Ca 2 Cu 3 O 10 The superconducting material is cut into a section size of 1.2×0.5×5mm 3 p-type thermoelectric element. In order to better connect the thermoelectric element with the copper guide fin, copper is plated on both ends of the n-type thermoelectric element and the p-type thermoelectric element, and the copper-plated thermoelectric element and the copper guide fin are welded together with copper electrodes, which greatly increases the Reduced interface resistance and improved welding performance. Solder the power wire on the copper guide plate, and the low temperature thermoelec...
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