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Multi-material surface exposure 3D printing method for lattice structure capacitor

A technology of dot matrix structure and 3D printing, which is applied in the direction of liquid material additive processing, additive processing, process efficiency improvement, etc., and can solve problems such as the inability to apply capacitor devices, complex multi-material lattice structures, etc.

Active Publication Date: 2022-05-31
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a multi-material surface exposure 3D printing method for a capacitor device with a lattice structure, which solves the problem in the prior art that complex and multi-material lattice structures cannot be applied to capacitor devices, and can use different materials in Spatial distribution in a lattice structure modulates capacitive performance of capacitive devices

Method used

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  • Multi-material surface exposure 3D printing method for lattice structure capacitor
  • Multi-material surface exposure 3D printing method for lattice structure capacitor
  • Multi-material surface exposure 3D printing method for lattice structure capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1) Choose a flexible photosensitive resin with a break elongation of 100% and a tensile strength of 6MPa. A rigid photosensitive resin with an elongation at break of 30% and a tensile strength of 50MPa. Multi-walled carbon nanotubes (MWCNTs) with a diameter of 8-15 nm and a length of 3-10 μm were selected as conductive fillers;

[0036] 2) Add 2wt% carbon nanotubes to the flexible photosensitive resin, and then add 1wt% CC-9 superdiscent agent, and the flexible photosensitive resin mixed with nanocarbon tubes is dispersed by planet grinding method, and the nano carbon tube flexible photosensitive resin is added. The viscosity test of the composite resin prepared by the prepared carbon nanotubes is carried out by rheometer. Ensure that the shear rate of the resin is 10 to 300s -1 when the viscosity is less than 2000mPa.s;

[0037] 3) Using the surface exposure printer, test the curing characteristics of the flexible photosensitive resin with nanocarbon tubes and the rigid phot...

Embodiment 2

[0040] 1) Choose a flexible photosensitive resin with a fracture elongation of 150% and a tensile strength of 8MPa. A rigid photosensitive resin with an elongation at break of 35% and a tensile strength of 65 MPa. Multi-walled carbon nanotubes (MWCNTs) with a diameter of 8-15 nm and a length of 3-10 μm were selected as conductive fillers;

[0041] 2) Add 1wt% carbon nanotubes to the flexible photosensitive resin, and then add 0.5wt% CC-9 superdiscent agent, and the flexible photosensitive resin mixed with nanocarbon tubes is dispersed by planetary grinding method to obtain the addition of nanocarbon tube flexible photosensitive resin. The viscosity test of the composite resin prepared by the prepared carbon nanotubes is carried out by rheometer. Ensure that the shear rate of the resin is 10 to 300s -1 when the viscosity is less than 1000mPa.s;

[0042] Steps 3, 4 is the same as Example 1.

Embodiment 3

[0044] 1) Choose a flexible photosensitive resin with a fracture elongation of 150% and a tensile strength of 8MPa. A rigid photosensitive resin with an elongation at break of 35% and a tensile strength of 65 MPa. Multi-walled carbon nanotubes (MWCNTs) with a diameter of 8-15 nm and a length of 3-10 μm were selected as conductive fillers;

[0045] 2) Add 1.5wt% carbon nanotubes to the flexible photosensitive resin, and then add 0.5wt% CC-9 superdiscent agent, and the flexible photosensitive resin mixed with nanocarbon tubes is dispersed by planet grinding method, and the nanocarbon tube flexible photosensitive resin is added. The viscosity test of the composite resin prepared by the prepared carbon nanotubes is carried out by rheometer. Ensure that the shear rate of the resin is 10 to 300s -1 when the viscosity is less than 1000mPa.s;

[0046] Steps 3, 4 is the same as Example 1.

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Abstract

The invention discloses a multi-material surface exposure 3D printing method of a lattice structure capacitor device, which comprises the following steps of: 1) adopting rigid photosensitive resin and flexible photosensitive resin with significant difference in elongation at break as base materials, and selecting a multi-walled carbon nanotube as a conductive filler; 2) adding a specific content of carbon nanotubes into the flexible photosensitive resin, then adding a CC-9 hyperdispersant, and dispersing the carbon nanotubes in the flexible photosensitive resin mixed with the carbon nanotubes and the CC-9 hyperdispersant in a planetary ball milling manner to obtain the flexible photosensitive resin added with the carbon nanotubes; (3) carrying out molding manufacturability test on single-layer and multi-layer curing by utilizing a surface exposure printer; and 4) printing standard impedance test pieces of flexible photosensitive resin and rigid photosensitive resin, designing a firewood stack and a honeycomb cell element structure, and assembling into a three-dimensional lattice structure for 3D printing. The problem that in the prior art, a complex and multi-material lattice structure cannot be applied to a capacitor device is solved.

Description

Technical field [0001] The present invention belongs to the field of resin composite materials and devices in light curing additive manufacturing technology, specifically relates to a multi-material surface exposure 3D printing method of a dot matrix structure capacitor part. Background [0002] The rapid development of additive manufacturing (3D printing) technology in the past few years has made it possible to process high-performance complex resin parts with fast, personalized and high precision. It is expected to further expand the application scope of functional resin parts, reduce R&D costs in aerospace, automotive and other fields, and improve the speed of R&D. However, there are currently few applications of additively manufactured conductive resin parts and corresponding devices. How to apply the advantages and characteristics of additive manufacturing to the molding of resin composites and devices is an important direction that needs to be broken. [0003] Commercial li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/106B29C64/188B33Y10/00B33Y70/10
CPCB29C64/106B29C64/188B33Y10/00B33Y70/10Y02P10/25
Inventor 武向权徐春杰杨怡马东张忠明
Owner XIAN UNIV OF TECH